NTCS0402E3473JXT Vishay, NTCS0402E3473JXT Datasheet - Page 5

• Manufacturer Part Number: NTCS0402E3473JXT
• Description: THERMISTOR NTC 47K OHM SMT 0402
• Manufacturer: Vishay
• Series: 2381r

Specifications of NTCS0402E3473JXT

• Resistance In Ohms @ 25°c: 47K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±3%
• B25/85: 4075K
• Operating Temperature: -40°C ~ 150°C
• Power - Max: 70mW
• Mounting Type: Surface Mount
• Package / Case: 0402 (1005 Metric)
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• B0/50: -
• B25/50: -
• B25/75: -
• B25/100: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 2381 615 43473; BC2337TR

SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
Document Number: 29003
Revision: 16-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D
0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A
0
B
P
50
0
1
P
Reflow Soldering
2
TEST METHOD
2 K/s
P
0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
E
F
JWB288
This datasheet is subject to change without notice.
40 s
0.5
Resistance to soldering heat
1
SMD 0402, Glass Protected
W
200
Solderability
NTC Thermistors
0.5
Dimensions of the solder lands
TEST
T
T
250
1
1.5
Notes
• Measured 0.3 mm above base pocket
• P
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
1
0
0
1
0
1
2
0
0
cover tape
[e-mail]
(1)
(1)
(2)
pitch cumulative error over any 10 pitches ± 0.2 mm
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
Vishay BCcomponents
≈ 120 °C
DIMENSION
NTCS0402E3.....T
150
Time (s)
< 0.1
0.65
1.15
1.75
1.55
Min. 95 % of surface wetted
8.0
3.5
4.0
4.0
2.0
0.8
200
www.vishay.com/doc?91000
REQUIREMENTS
R/R < 5 %
250
20 s min.
40 s max.
≈ 60 s
TOLERANCE
www.vishay.com
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.1
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
Max.
-
350
9