C2012X7R1A106K TDK Corporation, C2012X7R1A106K Datasheet - Page 21

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C2012X7R1A106K

Manufacturer Part Number
C2012X7R1A106K
Description
CAP CER 10UF 10V X7R 10% 0805
Manufacturer
TDK Corporation
Series
Cr
Datasheet

Specifications of C2012X7R1A106K

Voltage - Rated
10V
Capacitance
10µF
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
0.057" (1.45mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-6857-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C2012X7R1A106K
Manufacturer:
MAXIM
Quantity:
250
Part Number:
C2012X7R1A106K125AC
Manufacturer:
TDK
Quantity:
600 000
No.
5
Soldering
Process
5-4. Avoiding thermal shock
1)
2)
5-5. Amount of solder
5-6. Solder repair by solder iron
1) Selection of the soldering iron tip
Preheating condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
Cooling condition
Excessive
solder
Adequate
Insufficient
solder
Tip temperature of solder iron varies by its type, P.C.board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition. (Please preheat the
chip capacitors with the condition in 5-4 to avoid the thermal shock.)
Recommended solder iron condition (Pb-Sn Solder and Lead Free Solder)
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Manual soldering
Reflow soldering
Wave soldering
Temp. (°C)
300 max.
Soldering
—— 20 ——
Duration (sec.)
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
3 max.
Condition
Type
Wattage (W)
20 max.
Maximum amount
Minimum amount
Higher tensile force in
chip capacitors to cause
crack
Low robustness may
cause contact failure or
chip capacitors come off
the P.C.board.
Shape (mm)
Ø 3.0 max.
Temp. (°C)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130

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