DB-60-20 Cinch Connectors, DB-60-20 Datasheet - Page 4

• Manufacturer Part Number: DB-60-20
• Description: CONN DSUB15 PLUG DUST CAP
• Manufacturer: Cinch Connectors
• Type: Plugr

Specifications of DB-60-20

• Accessory Type: Cap (Cover), Dust
• Number Of Positions: 15
• Product: Tools & Accessories
• Number Of Positions / Contacts: 25
• Shell Size: B
• Gender: Male
• Housing Material: Polyethylene
• Color: Black
• Height, External: 0.430 in.
• Height, Internal: 0.363 in.
• Length, Inner: 1.568 in.
• Length, Outer: 1.635 in.
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: D-Sub Connectors, Male
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With: All Cinch D-subminiature connectors
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 4741192302

The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
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