XF2J-1024-11A Omron, XF2J-1024-11A Datasheet - Page 17
![CONN FPC 10POS 0.5MM PITCH SMD](/photos/2/87/28737/xf2j-1024-11a_sml.jpg)
XF2J-1024-11A
Manufacturer Part Number
XF2J-1024-11A
Description
CONN FPC 10POS 0.5MM PITCH SMD
Manufacturer
Omron
Series
XF2Jr
Specifications of XF2J-1024-11A
Contact Plating
Gold
Connector Type
Vertical Contacts, 1 Sided
Number Of Positions
10
Pitch
0.020" (0.50mm)
Ffc, Fcb Thickness
0.30mm
Height Above Board
0.163" (4.15mm)
Mounting Type
Surface Mount
Cable End Type
Tapered
Termination
Solder
Locking Feature
Slide Lock
Features
Zero Insertion Force (ZIF)
Contact Finish
Gold
Contact Finish Thickness
5.9µin (0.15µm)
Operating Temperature
-30°C ~ 85°C
Current Rating
0.500A
Voltage Rating
50V
Housing Material
Polyamide (PA46), Nylon 4/6
Product Type
PCB
Number Of Positions / Contacts
10
Mounting Angle
Vertical
Mounting Style
SMD/SMT
Contact Material
Spring Copper Alloy / Nickel Substrate
Actuation Type
ZIF
Contact Location
Top Contact
Termination Style
Solder
Gender
Receptacle
Pitch Spacing
0.5mm
No. Of Contacts
10
No. Of Rows
1
Ffc/fpc Thickness
0.3mm
Contact Termination
Surface Mount Vertical
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
OR735TR
XF2J102411A
XF2J102411A
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XF2J-1024-11A
Manufacturer:
EOS
Quantity:
65
Greater Freedom in Board Design with a Bottom
Wall and the Smallest On-board Area in the Industry
• Smallest on-board area and volume in the industry.
• Low on-board profile of only 1.2 mm.
• Highest board design surface efficiency in the industry with
• Construction with secure slider locking mechanism.
• Applicable FPC thickness of 0.3 mm.
■ Ratings and Specifications
XF2L-@@@5-1A
■ Dimensions
Table of Dimensions
Upper-contact Models
XF2L-@@@5-1@
Rated current
Rated voltage
Contact resistance
Insulation resistance 100 M Ω min. (at 250 V DC)
Withstand voltage
Insertion tolerance
Ambient operating
temperature
note 2.)
ZIF Slide-locking Connector
(0.5-mm Pitch)
RoHS Compliant
a bottom wall preventing terminal exposure.
Pins
(See
1.05
10
12
13
18
21
26
30
4
6
7
8
9
1
XF2L- @@25-1 (Upper-contact Models)
XF2L- @@35-1 (Lower-contact Models)
(See note 1.)
XF2L-0425-1@
XF2L-0625-1@
XF2L-0725-1@
XF2L-0825-1@
XF2L-0925-1@
XF2L-1025-1@
XF2L-1225-1@
XF2L-1325-1@
XF2L-1825-1@
XF2L-2125-1@ 10.0 14.4 15.4 11.1 14.38 15.38 13.78 15.78
XF2L-2625-1@ 12.5 16.9 17.9 13.6 16.88 17.88 16.28 18.28
XF2L-3025-1@ 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28
Model
0.5
0.5 A AC/DC
50 V AC/DC
30 m Ω max.
(at 20 mV DC max., 100 mA max.)
250V AC for 1 min.
(leakage current: 1 mA max.)
20 times
− 30 to 85 ° C
(with no icing or condensation)
D
B
A
C
D
A
1.5
2.5
3.0
3.5
4.0
4.5
5.5
6.0 10.4 11.4
8.5 12.9 13.9
0.2
B
5.9
6.9
7.4
7.9
8.4
8.9
9.9 10.9
C
6.9
7.9
8.4
8.9
9.4
9.9
D
2.6
3.6
4.1
4.6
5.1
5.6
6.6
7.1 10.38 11.38
9.6 12.88 13.88 12.28 14.28
5.88
6.88
7.38
7.88
8.38
8.88
9.88 10.88
0.75
E
2.5 min.
0.35
0.5
6.88
7.88
8.38
8.88
9.38
9.88
Applicable FPC Dimensions
F
3.05
±0.1
±0.03
3.05
3.45
3.45
5.28
6.28
6.78
7.28
7.78
8.28 10.28
9.28 11.28
9.78 11.78
G
(D−0.1)
1.2
1.2
0.5
A
7.28
8.28
8.78
9.28
9.78
H
±0.05
±0.05
±0.05
With slider open
With slider open
■ Materials and Finish
XF2L-@@@5-1A
Lower-contact Models
Reinforcement board
Ordering
Housing
Slider
Contacts
Hold-down Spring copper alloy/fused-tin plating (1.5 μ m)
1.35 (Effective
interface length)
T=0.3±0.03
(Conductive plating)
note 2.)
4.55
4.55
Pins
(See
10
12
13
15
18
19
20
22
24
30
(See note.)
5
6
7
8
Model
(5)
(See note 1.)
XF2L-0535-1@
XF2L-0635-1@
XF2L-0735-1@
XF2L-0835-1@
XF2L-1035-1@
XF2L-1235-1@
XF2L-1335-1@
XF2L-1535-1@
XF2L-1835-1@
XF2L-1935-1@
XF2L-2035-1@
XF2L-2235-1@ 10.5 14.9 15.9 11.6 14.88 15.88 14.28 16.28
XF2L-2435-1@ 11.5 15.9 16.9 12.6 15.88 16.88 15.28 17.28
XF2L-3035-1@ 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28
0.55
LCP resin (UL94V-0)/natural
LCP resin (UL94V-0)/black
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
Model
1.34
(Upper-contact Models)
±0.1
±0.1
1
±0.1
Note. Use polyimide and thermoset adhesive for
XF2L
PCB Mating Dimensions (Top View)
A
2.0
2.5
3.0
3.5
4.5
5.5
6.0 10.4 11.4
7.0 11.4 12.4
8.5 12.9 13.9
9.0 13.4 14.4 10.1 13.38 14.38 12.78 14.78
9.5 13.9 14.9 10.6 13.88 14.88 13.28 15.28
reinforcement film material.
B
6.4
6.9
7.4
7.9
8.9
9.9 10.9
0.5
C
7.4
7.9
8.4
8.9
9.9
±0.05
A
G
H
D
3.1
3.6
4.1
4.6
5.6
6.6
7.1 10.38 11.38
8.1 11.38 12.38 10.78 12.78
9.6 12.88 13.88 12.28 14.28
LCP resin (UL94V-0)/
brown
±0.05
F
E
±0.1
±0.1
XF2L
(Lower-contact Models)
0.25
6.38
6.88
7.38
7.88
8.88
9.88 10.88
+0.05
E
0
XF2L
7.38
7.88
8.38
8.88
9.88
F
5.78
6.28
6.78
7.28
8.28 10.28
9.28 11.28
9.78 11.78
G
7.78
8.28
8.78
9.28
H
17