XF2H-2015-1 Omron, XF2H-2015-1 Datasheet - Page 15

• Manufacturer Part Number: XF2H-2015-1
• Description: CONN FPC 20POS 0.5MM SMT
• Manufacturer: Omron
• Series: XF2Hr
• Type: FPC Connectorr

Specifications of XF2H-2015-1

• Connector Type: Top and Bottom Contacts
• Number Of Positions: 20
• Pitch: 0.020" (0.50mm)
• Ffc, Fcb Thickness: 0.30mm
• Height Above Board: 0.079" (2.00mm)
• Mounting Type: Surface Mount, Right Angle
• Cable End Type: Straight
• Termination: Solder
• Locking Feature: Rotary Lock, Backlock
• Features: Zero Insertion Force (ZIF)
• Contact Finish: Tin Alloy
• Contact Finish Thickness: 79µin (2.00µm)
• Operating Temperature: -30°C ~ 85°C
• Current Rating: 0.500A
• Voltage Rating: 50V
• Housing Material: Polyamide (PA46), Nylon 4/6
• Contact Gender: SKT
• Mounting Style: Surface Mount
• Number Of Contact Rows: 1
• Number Of Contacts: 20POS
• Pitch (mm): 0.5mm
• Body Orientation: Right Angle
• Contact Resistance Max: 30mOhm
• Voltage Rating Max: 50VDC
• Operating Temp Range: -30C to 85C
• Current Rating (max): 0.5A
• Housing Color: Natural
• Contact Material: Copper Alloy
• Contact Plating: Tin Alloy on Nickel
• Termination Method: Solder
• Product Height (mm): 3.44mm
• Product Depth (mm): 8.1mm
• Product Length (mm): 14.1mm
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: OR644TR; XF2H20151

Rotary Lock Achieves High Reliability and Superior
Work Efficiency.
• Double-sided contact reduces the number of parts.
• Applicable FPC thickness of 0.3 mm.
■ Ratings and Specifications
XF2M-@@15-1A/1AH
■ Dimensions
XF2M-@@15-1@
XF2M-@@15-1@H
Table of Dimensions
Note: Dotted lines refer to the shape and dimensions of models XF2M-5515-1 H
and 6015-1 H.
Note: “H” refers to the shape and dimensions for model series XF2M-5515 and
6015. Please refer to the drawings for more information.
Rated current
Rated voltage
Contact resistance
Insulation resistance 100 M Ω min. (at 250 V DC)
Withstand voltage
Insertion tolerance
Ambient operating
temperature
Pins
(See
note
Rotary Backlock Connector
(0.5-mm Pitch, Double-sided Contact)
(55) XF2M-5515-1@H 27.0 28.1 31.0 31.6 29.6 28.6 32.0
(60) XF2M-6015-1@H 29.5 30.6 33.5 34.1 32.1 31.1 34.5
RoHS Compliant
2.)
10
12
14
18
20
22
24
26
30
32
33
34
35
36
38
40
42
45
50
55
60
XF2M-1015-1@
XF2M-1215-1@
XF2M-1415-1@
XF2M-1815-1@
XF2M-2015-1@
XF2M-2215-1@ 10.5 11.6 14.5 15.1 13.1 12.1 15.5
XF2M-2415-1@ 11.5 12.6 15.5 16.1 14.1 13.1 16.5
XF2M-2615-1@ 12.5 13.6 16.5 17.1 15.1 14.1 17.5
XF2M-3015-1@ 14.5 15.6 18.5 19.1 17.1 16.1 19.5
XF2M-3215-1@ 15.5 16.6 19.5 20.1 18.1 17.1 20.5
XF2M-3315-1@ 16.0 17.1 20.0 20.6 18.6 17.6 21.0
XF2M-3415-1@ 16.5 17.6 20.5 21.1 19.1 18.1 21.5
XF2M-3515-1@ 17.0 18.1 21.0 21.6 19.6 18.6 22.0
XF2M-3615-1@ 17.5 18.6 21.5 22.1 20.1 19.1 22.5
XF2M-3815-1@ 18.5 19.6 22.5 23.1 21.1 20.1 23.5
XF2M-4015-1@ 19.5 20.6 23.5 24.1 22.1 21.1 24.5
XF2M-4215-1@ 20.5 21.6 24.5 25.1 23.1 22.1 25.5
XF2M-4515-1@ 22.0 23.1 26.0 26.6 24.6 23.6 27.0
XF2M-5015-1@ 24.5 25.6 28.5 29.1 27.1 26.1 29.5
(See note 1.)
Model
0.5 A AC/DC
50 V AC/DC
50 m Ω max. (at 20 mV max., 100 mA max.)
250 V AC for 1 min.
20 times
− 30 to 85 ° C
(with no icing or condensation)
(leakage current: 1 mA max.)
A
4.5
5.5
6.5
8.5
9.5 10.6 13.5 14.1 12.1 11.1 14.5
B
5.6
6.6
7.6 10.5 11.1
9.6 12.5 13.1 11.1 10.1 13.5
8.5
9.5 10.1
C
9.1
D
7.1
8.1
9.1
E
6.1
7.1 10.5
8.1 11.5
F
G
9.5
Reference pin mark
0.5
PCB Mating Dimensions (Top View)
±0.05
■ Materials and Finish
XF2M-@@15-1A/1AH
Housing
Slider
Contacts
Hold-down Spring copper alloy/fused-tin plating (1.5 μ m)
0.5
A
F
G
±0.05
E
±0.1
A
B
C
D
±0.1
(See note.)
LCP resin (UL94V-0)/natural
LCP resin (UL94V-0)/black
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
0.25
0.15
(See note.)
±0.05
2.6
1.5
±0.1
±0.1
3.4
1.1
2
(Reinforcement
4.9
board)
4.5
Note: Dotted lines indicate the shape
0.35
0.5
0.5
2.5 min.
Applicable FPC Dimensions
4.88 (See note.)
±0.1
±0.05
±0.03
and dimensions of 55-pin or
60-pin connectors.
6.2 (See note.)
4.62
5.2
XF2M
5.9
(B−0.1)
0.92
(See note.)
±0.05
0.6
2.1
(See
note.)
3.1
T=0.3
(Conductive
plating)
3.2
(See
note.)
1.35
(Effective
interface
length)
±0.05
15