XF2H-3015-1 Omron, XF2H-3015-1 Datasheet - Page 7

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XF2H-3015-1

Manufacturer Part Number
XF2H-3015-1
Description
CONN FPC 30POS 0.5MM SMT
Manufacturer
Omron
Series
XF2Hr
Datasheet

Specifications of XF2H-3015-1

Connector Type
Top and Bottom Contacts
Number Of Positions
30
Pitch
0.020" (0.50mm)
Ffc, Fcb Thickness
0.30mm
Height Above Board
0.079" (2.00mm)
Mounting Type
Surface Mount, Right Angle
Cable End Type
Straight
Termination
Solder
Locking Feature
Rotary Lock, Backlock
Features
Zero Insertion Force (ZIF)
Contact Finish
Tin Alloy
Contact Finish Thickness
79µin (2.00µm)
Operating Temperature
-30°C ~ 85°C
Current Rating
0.500A
Voltage Rating
50V
Housing Material
Polyamide (PA46), Nylon 4/6
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
OR649TR
XF2H30151

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XF2H-3015-1
Manufacturer:
FCI
Quantity:
310
Part Number:
XF2H-3015-1-R1000
Manufacturer:
OMRON
Quantity:
180
Part Number:
XF2H-3015-1L
Manufacturer:
OMRON
Quantity:
38 577
Part Number:
XF2H-3015-1LW
Manufacturer:
OMRON
Quantity:
33 329
Rotary Backlock Mechanism with 0.3-mm Pitch
• Wide molding wall on the rear bottom of the connector allows greater
• Double-sided contact reduces the number of parts.
• Gold plated with an applicable FPC thickness of 0.2 mm.
■ Ratings and Specifications
■ Dimensions
XF2B-@@45-31A
Rated current
Rated voltage
Contact resistance
Insulation resistance 100 M Ω min. (at 250 V DC)
Withstand voltage
Insertion tolerance
Ambient operating
temperature
Table of Dimensions
Pins (See note 1.)
Rotary Backlock Connector
(0.3-mm Pitch, Double-sided Contact)
RoHS Compliant
freedom in board design.
(1.1)
0.3
(1.4)
17
21
23
25
27
31
33
35
39
41
45
51
61
0.6
0.6
A
B
D
C
XF2B-1745-31A
XF2B-2145-31A
XF2B-2345-31A
XF2B-2545-31A
XF2B-2745-31A
XF2B-3145-31A
XF2B-3345-31A
XF2B-3545-31A
XF2B-3945-31A
XF2B-4145-31A
XF2B-4545-31A
XF2B-5145-31A
XF2B-6155-31A
0.2 A AC/DC
50 V AC/DC
50 m Ω max. (at 20 mV max., 100 mA max.)
250 V AC for 1 min.
20 times
− 30 to 85 ° C
(with no icing or condensation)
(leakage current: 1 mA max.)
Model
0.15
0.12
1.2
10.8 11.4 12.1 13.6
11.4 12.0 12.7 14.2
12.6 13.2 13.9 15.4
14.4 15.0 15.7 17.2
17.4 18.0 18.7 20.2
0.1
A
4.2
5.4
6.0
6.6
7.2
8.4
9.0
9.6 10.2 10.9 12.4
0.55
B
4.8
6.0
6.6
7.2
7.8
9.0
9.6 10.3 11.8
5.5
6.7
7.3
7.9
8.5 10.0
9.7 11.2
C
5.2
5.5
D
7.0
8.2
8.8
9.4
0.5
1.23
0.5
2.1
■ Materials and Finish
Housing LCP resin (UL94V-0)/natural
Slider
Contacts
2
0.3
1.2
±0.07
0.6
1
0.25
±0.02
0.3
±0.05
LCP resin (UL94V-0)/black
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
PCB Mating Dimensions (Top View)
Applicable FPC Dimensions
0.3
0.6
(B+0.6)
±0.02
±0.02
B
A
±0.03
0.6
±0.03
0.6
±0.05
±0.05
0.3
±0.05
+0.04
−0.03
A
B
±0.05
±0.05
0.3
0.8 (Effective interface length)
Two, R0.2 max.
(Effective interface length)
+0.04
−0.03
T=0.2±0.03
(Conductive plating)
0.75
0.75
0.3
1.6
0.3
±0.05
±0.05
±0.05
±0.05
5.4
XF2B
±0.1
2.5
(Reinforcement board)
±0.03
4.5
7

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