812002 MULTICOMP, 812002 Datasheet

SOLDER WIRE, , 1MM, 250G

812002

Manufacturer Part Number
812002
Description
SOLDER WIRE, , 1MM, 250G
Manufacturer
MULTICOMP
Datasheet
1.812000.pdf (5 pages)

Specifications of 812002

External Diameter
1mm
Material Composition
Sn97.1Ag2.6Cu0.3
Melting Temperature
217°C
Weight
250g
Svhc
No SVHC (18-Jun-2010)
Bit Temperature
350°C
Flux Type
400, Rosin Based, Halide Free
Standard
DIN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Multicomp Typ 400, 505 and 511 solid fluxes for cored solder wires have been specially formulated to complement no clean wave
and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the
need for further cleaning.
Product Range:
Multicomp Typ 400 is designed for users who require a halide free formulation. The remaining products in the range contain higher
halide levels to maximise soldering power.
Multicomp Typ 400, 505 and 511 cored wires are manufactured with a range of flux contents. Although users will normally be using
products with a nominal flux content of 3%, the superior performance of the Multicomp Typ 400, 505 and 511 products may allow a
lower flux content to be specified e.g. 2.2%. This will further improve residue appearance by reducing the quantity. All are available in
alloys conforming to national and international standards, including lead free alloys.
Recommended Operating Conditions:
Soldering Iron:
Good results should be obtained using a range of tip temperatures. However, the optimum tip temperature and heat capacity required
for a hand soldering process is a function of both soldering iron design and the nature of the task and care should be exercised to
avoid unnecessarily high tip temperatures for excessive times. A high tip temperature will increase any tendency to flux spitting and it
may produce some residue darkening.
The soldering iron tip should be properly tinned and this may be achieved using Multicomp Typ 400, 505 and 511 cored wire.
Severely contaminated soldering iron tips should first be cleaned and pre-tinned using a soldering iron tip tinner, then wiped on a
clean, damp sponge before re-tinning with Multicomp cored wire.
Soldering process:
Flux cored wires Typ 400, 505 and 511 contain a careful balance of resins and activators to provide clear residues, maximum activity
and high residue reliability, without cleaning in most situations. To achieve the best results from solder wires, recommended working
practices for hand soldering should be observed as follows:
•
•
•
The total process will be very rapid, depending upon thermal mass, tip temperature and configuration and the solderability of the
surfaces to be joined.
Multicomp flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of
the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability
of fluxes Typ 400, 505 and 511 means, they are also well suited to soldering applications requiring high melting temperature alloys.
The resin and flux systems are designed to leave relatively low residues and to minimise residual activity. This is achieved by
ensuring some decomposition and volatilisation takes place during the soldering process. In some situations, this may generate
visible fuming but in all cases, rosin fumes must be removed from the breathing zone of operators.
No-Clean Flux
Lead Free Tin/Silver/Copper Alloy
Apply the soldering iron tip to the work surface, ensuring that it simultaneously contacts the base material and the component
termination to heat both surfaces adequately. This process should only take a fraction of a second.
Apply flux cored solder wire to a part of the joint surface away from the soldering iron and allow to flow sufficiently to form a
sound joint fillet - this should be virtually instantaneous. Do not apply excessive solder or heat to the joint as this may result in
dull, gritty fillets and excessive or darkened flux residues.
Remove solder wire from the workpiece and then remove the iron tip.
Page 1
Features:
•
•
•
•
•
•
Halide free version-Typ 400.
Mild odour.
Fast soldering-range of activities to suit all applications.
Clear residues.
Good spread on copper, brass and nickel.
Heat stable-low spitting.
25/05/06 V1.0

812002 Summary of contents

Page 1

... Multicomp Typ 400, 505 and 511 cored wires are manufactured with a range of flux contents. Although users will normally be using products with a nominal flux content of 3%, the superior performance of the Multicomp Typ 400, 505 and 511 products may allow a lower flux content to be specified e.g. 2.2%. This will further improve residue appearance by reducing the quantity. All are available in alloys conforming to national and international standards, including lead free alloys ...

Page 2

... Technical Specification: Alloys: The alloys used for Multicomp Typ 400, 505 and 511 cored solder wires conform to the purity requirements of the common national and international standards. A wide range of wire diameters is available manufactured to close dimensional tolerances. Flux: The solid fluxes are based on modified rosins and carefully selected activators. In use they exhibit a mild rosin odour and leave a small quantity of clear residue ...

Page 3

... Lead Free Tin/Silver/Copper Alloy Cored wire: Multicomp Typ 400, 505 and 511 cored solder wires are designed to give fast and sustained wetting on both copper and brass. This can be demonstrated using spreading tests on both substrates under standard conditions for the Multicomp products and comparable competitor products ...

Page 4

... Solder Wire, PB-Free, 0.7mm, 250g Solder Wire, PB-Free, 1.0mm, 250g Solder Wire, PB-Free, 1.2mm, 250g Solder Wire, PB-Free, 0.7mm, 500g Solder Wire, PB-Free, 1.0mm, 500g Solder Wire, PB-Free, 1.2mm, 500g Part Number 812000 812001 812002 812003 812004 812005 812006 Page 4 25/05/06 V1.0 ...

Page 5

... Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. Multicomp is the registered trademark of the Group. © Premier Farnell plc 2004. ...