CCM01-2251LFT T30 C&K Components, CCM01-2251LFT T30 Datasheet - Page 17
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CCM01-2251LFT T30
Manufacturer Part Number
CCM01-2251LFT T30
Description
CONN SMART CARD DETECT 8PIN SMD
Manufacturer
C&K Components
Series
CCM01 MK IIr
Specifications of CCM01-2251LFT T30
Card Type
Smart Card
Number Of Positions
10 (8 + 2)
Connector Type
Connector
Insertion, Removal Method
Push In, Pull Out
Mounting Type
Surface Mount, Right Angle
Features
Board Guide, Switch
Height Above Board
0.248" (6.30mm)
Mounting Feature
Normal, Standard - Top
Contact Finish
Gold
Product
Card Connectors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Contact Finish Thickness
-
Ejector Side
-
Other names
*CCM01-2251LFT
*CCM01-2251LFT T30
401-1710
CCM01-2251 LFT
CCM01-2251LFT
Y1112-2251A LFT
*CCM01-2251LFT T30
401-1710
CCM01-2251 LFT
CCM01-2251LFT
Y1112-2251A LFT
PRODUCT SPECIFICATION
8 - Process environment
Soldering processes :
Solder heat resistance
Static load (transverse)
(CCM / PCB)
Terminal robustness
Contact retention in insert
Metallic peg retention in housing
Reinforced version
Solderability (wetting balance)
Dust sealed test (only for switch)
Resistance to fluids
9 – Operating environment
Operating life
Vibration
Mechanical shock
Rapid change of temperature
Climatic sequence
Dry heat storage
Lead free reflow soldering
process (SMT terminals)
Lead Free single or double
wave soldering process
(through Hole Terminals)
CCM01-MKII V2-LFT
Ref. / PS-CCM01-MKII-2
3 cycles at max profile according to IEC
61760-1:2006
According to IEC 60068-2-58
10 N / 1 mn / 4 directions (standard version)
40 N / 1 mn / 4 directions (reinforced version)
According to IEC 512-5 test 8a/8b
1 bend / 45° / forward & back
According to IEC 60068-2-21 test Ub method 1
2 N / 10sec./ displacement < 0.3 mm
According to IEC 512-8 test 15a
245°C
According to IEC 60068-2-69
Dust test / IP5x
According to IEC 60529:1989/A1:1999
The product is not compatible with washing
process.
Recommendation: 4 metal pegs.
Other configurations are possible, according to
customer integration.
10-500 Hz / 50 m/s² / 3 axis / 2 hours per axis
No discontinuity > 1 µs
According to IEC 60068-2-6.
500 m/s² / ½ sinusoidal / 11 ms
3 shocks in the 2 directions of the 3 axis
No discontinuity > 1 µs
According to IEC 60068-2-27.
100 cycles / - 40°C / + 85°C
According to IEC60068-2-14, test Nb
Dry heat : 85°C / 16 hours
Damp heat : 1 cycle 24 hours 55°C & 93% HR
Cold : – 40°C / 2 hours
Damp heat : 1 cycle 24 hours 55°C & 93% HR
According to IEC 60068-2-61, test Z/ABDM
85°C / 250 hours
According to IEC 60068-2-2 , test Bb.
Recommendation for solder paste thickness :
30 N (lateral & axial directions)
100 000 cycles
According to IEC 61760-1:2006
According to IEC 61760-1:2006
at 10 N force for standard version
at 40 N force for reinforced version
September 2008
Issue 1-rev.G
Page 6 / 8
0.20 mm