45593-1600 Molex Inc, 45593-1600 Datasheet - Page 7

• Manufacturer Part Number: 45593-1600
• Description: CONN PLUG 16POS .8MM VERT PCB
• Manufacturer: Molex Inc
• Series: HandyLink™ 45593r

Specifications of 45593-1600

• Connector Style: Plug
• Connector Type: Handylink
• Number Of Positions: 16
• Mounting Type: Through Hole
• Termination: Solder
• Contact Finish: Gold
• Color: Black
• Housing Material: Thermoplastic, High Temperature
• Insulation Resistance: 1000 M Ohms
• Mounting Angle: Vertical
• Operating Temperature Range: - 40 C to + 85 C
• Number Of Positions / Contacts: 16
• Pitch: 0.8 mm
• Contact Plating: Gold, Tin
• Contact Material: High Performance Alloy (HPA)
• Gender: Male
• Current Rating: 1.5 A
• Mounting Style: Through Hole
• Termination Style: Solder
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 045593-1600; 045593-1600-E; 0455931600; 0455931600-E; 45593-1600-E; 455931600; 455931600-E; WM17126

REVISION:
DOCUMENT NUMBER:
5.0 SOLDERING PROCESS RECOMMENDATIONS
5.1 44828 SMT Receptacle Connector
5.2 45560 SMT Cradle Connector
A1
4.3
The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the
final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see
Section 6.4 Design Best Practices for further detailed information.
5.1.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required.
5.1.2 Solder Paste Stencil Layout
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.
5.1.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.
5.1.4 Inspection
Solder joints should be inspected using established conventional methods.
5.2.1 PCB Layout
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is
required.
5.2.2 Solder Paste Stencil Layout
See Sales Drawing for recommended PCB pad layout and solder paste thickness.
Clearances Between Mated Parts
SD-45593-001
EC No:
DATE:
ECR/ECN INFORMATION:
UCP2006-2962
2006/08/07
APPLICATION SPECIFICATION
TITLE:
CREATED / REVISED BY:
Marc Simmel
HANDYLINK™
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
Marc Simmel
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
APPROVED BY:
Joe Comerci
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