P-302-CCT-L Cinch Connectors, P-302-CCT-L Datasheet - Page 4
P-302-CCT-L
Manufacturer Part Number
P-302-CCT-L
Description
CONN PLUG 2POS W/LOCK JONES SLDR
Manufacturer
Cinch Connectors
Series
300r
Datasheet
1.P-304-CCT-L.pdf
(282 pages)
Specifications of P-302-CCT-L
Connector Type
Plug, Jones
Contact Type
Tab
Number Of Positions
2
Pitch
0.156" (3.96mm)
Number Of Rows
1
Mounting Type
Free Hanging (In-Line)
Fastening Type
Latch Lock
Cable Termination
Solder Eyelet
Wire Type
Discrete
Features
Cable Clamp
Contact Finish
Cadmium
Color
Black
Contact Material
Brass
Contact Plating
Cadmium
Housing Material
Thermoplastic
Number Of Positions / Contacts
2
Voltage Rating
250 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Contact Finish Thickness
-
Row Spacing
-
Lead Free Status / Rohs Status
No RoHS Version Available
Other names
CJ202P
P-302-CCT-L-P
P302CCTL-P
P-302-CCT-L-P
P302CCTL-P
- Current page: 4 of 282
- Download datasheet (6Mb)
The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
Call Toll Free: 1 (800) 323-9612
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