LM1851N National Semiconductor, LM1851N Datasheet - Page 2

• Manufacturer Part Number: LM1851N
• Description: IC,Ground Fault Interrupter,BIPOLAR,DIP,8PIN,PLASTIC
• Manufacturer: National Semiconductor

Specifications of LM1851N

• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum Ratings
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Supply Current
Power Dissipation (Note 1)
Operating Temperature Range
Storage Temperature Range
DC Electrical Characteristics
AC Electrical Characteristics
Note 1 For operation in ambient temperatures above 25 C the device must be derated based on a 125 C maximum junction temperature and a thermal resistance
of 80 C W junction to ambient for the DIP and 162 C W for the SO Package
Note 2 Average of 10 trials
Note 3 Required UL sensitivity tolerance is such that external trimming of LM1851 sensitivity will be necessary
Note 4 This externally applied current is in addition to the internal ‘‘output drive current’’ source
Power Supply Shunt
Regulator Voltage
Latch Trigger Voltage
Sensitivity Set Voltage
Output Drive Current
Output Saturation Voltage
Output Saturation Resistance
Output External Current
Sinking Capability
Noise Integration
Sink Current Ratio
Normal Fault Current
Sensitivity
Normal Fault Trip Time
Normal Fault with
Grounded Neutral Fault
Trip Time
Parameter
Parameter
Figure 1 (Note 3)
500
500
2
FIGURE 1 Normal Fault Sensitivity Test Circuit
Neutral Figure 2 (Note 2)
Pin 8 Average Value
Pin 7
Pin 8 to Pin 6
Pin 1 With Fault
Pin 1 Without Fault
Pin 1 Without Fault
Pin 1 Without Fault
V
Pin 7 Ratio of Discharge
Currents Between No Fault
and Fault Conditions
b
pin 1
Fault Figure 2 (Note 2)
Normal Fault
b
55 C to
40 C to
Conditions
Held to 0 3V (Note 4)
Conditions
T
T
1250 mW
A
A
a
e
e
a
19 mA
150 C
25 C I
25 C I
70 C
SS
SS
2
e
e
5 mA
5 mA
Soldering Information
See AN-450 ‘‘Surface Mounting and Their Effects on Prod-
uct Reliability’’ for other methods of soldering surface
mount devices
Dual-In-Line Package (10 sec )
Small Outline Package
Vapor Phase (60 sec )
Infrared (15 sec )
Min
3
Min
0 5
2 0
2 0
22
15
6
Typ
17 5
Typ
100
100
18
18
2 8
26
5
7
1
5
TL H 5177 – 2
Max
240
Max
8 2
2 4
3 6
30
20
7
Units
Units
A
mA
mV
mA
mA
ms
ms
260 C
215 C
220 C
V
V
V
A