SL1021A250C Littelfuse Inc, SL1021A250C Datasheet - Page 3
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SL1021A250C
Manufacturer Part Number
SL1021A250C
Description
BULK / GDT / GP BETA 3T A250V CORE
Manufacturer
Littelfuse Inc
Series
SL1021Ar
Datasheet
1.SL1021A090R.pdf
(5 pages)
Specifications of SL1021A250C
Rohs Compliant
YES
Spark Over Voltage
250V
Impulse Discharge Current
10kA 8x20µs
Package / Case
Non-Standard SMD
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Time vs. Current for Failsafe
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus Temp
(T
T
Reflow
Peak Temperature (T
Time within 5°C of actual peak
Temperature (t
Ramp-down Rate
Time 25°C to peak Temperature (T
Do not exceed
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
260
240
220
200
180
160
140
120
100
60
30
20
S(max)
Time (Seconds)
15
14
13
12
10
80
60
40
20
11
L
0
9
8
7
6
5
4
3
2
1
0.5
) to peak
1
to T
2
L
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (Min to Max) (t
- Temperature (T
- Temperature (t
5
p
)
SL102xA with Failsafe
SL102xB or PMT8 500 Volt Higher Melting Point Solder
SL102xB or PMT8 350 Volt Higher Melting Point Solder
SL102xB or PMT8 90 Volt Higher Melting Point Solder
Preheat Time
P
)
10
L
L
)
) (Liquidus)
15
s(min)
s(max)
s
)
P
Dwell Time
)
)
)
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
5°C/second max
217°C
60 – 150 seconds
260
10 – 30 seconds
6°C/second max
8 minutes Max.
260°C
Gas Discharge Tube (GDT) Products
SL1021A/B, SL1024A/B and PMT8 Series
Cooling Time
+0/-5
°C
Revised: November 10, 2009
30
21
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Recommended Process Parameters:
Note: Surge Arrestors with a Failsafe mechanism should be
individually examined after soldering
Preheat:
(Depends on Flux Activation Temperature)
Solder Pot Temperature:
Solder Dwell Time:
Voltage vs. Time Characteristic
Soldering Parameters - Hand Soldering
Temperature Minimum:
Temperature Maximum:
Preheat Time:
T
T
S(max)
S(min)
25
Wave Parameter
T
T
P
L
0
time to peak temperature
200
(t 25ºC to peak)
t
Preheat
400
S
Time (ns)
600
(Typical Industry Recommendation)
100
150
60-180 seconds
280
2-5 seconds
Ramp-up
Lead-Free Recommendation
SL1021A/B, SL1024A/B and PMT8 Series
Max dynamic breakover
voltage
°
°
°
Hold-over voltage
C
C
C Maximum
800
On-State voltage
t
t
P
L
1000
Time
Ramp-down
Critical Zone
1200
T
L
to T
P