5082-0012 Avago Technologies US Inc., 5082-0012 Datasheet - Page 2
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5082-0012
Manufacturer Part Number
5082-0012
Description
PIN DIODE,SINGLE,150V V(BR),Chip
Manufacturer
Avago Technologies US Inc.
Type
Attenuator/Switchr
Datasheet
1.5082-0012.pdf
(2 pages)
Specifications of 5082-0012
Diode Type
PIN - Single
Voltage - Peak Reverse (max)
150V
Capacitance @ Vr, F
0.12pF @ 50V, 1MHz
Resistance @ If, F
1 Ohm @ 100mA, 100MHz
Package / Case
Chip
Configuration
Single
Operating Temperature Classification
Military
Reverse Voltage
150V
Mounting
Surface Mount
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Max
-
Power Dissipation (max)
-
Lead Free Status / Rohs Status
Compliant
Other names
5082-12
5082-12
5082-12
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
5082-0012
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Assembly and Handling Procedures for
PIN Chips
1. Storage
Devices should be stored in a dry nitrogen purged
dessicator or equivalent.
2. Cleaning
If required, surface contamination may be removed
with electronic grade solvents. Typical solvents, such
as freon (T.F. or T.M.C.), acetone, deionized water, and
methanol, or their locally approved equivalents, can be
used singularly or in combinations. Typical cleaning
times per solvent are one to three minutes. DI water
and methanol should be used (in that order) in the final
cleans. Final drying can be accomplished by placing
the cleaned dice on clean filter paper and drying with
an infrared lamp for 5-10 minutes. Acids such as
hydrofluoric (HF), nitric (HNO
(HCl) should not be used.
The effects of cleaning methods/solutions should be
verified on small samples prior to submitting the
entire lot.
Following cleaning, dice should be either used in
assembly (typically within a few hours) or stored in
clean containers in a reducing atmosphere or a vacu-
um chamber.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte.
in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
Obsoletes 5965-8880E
5989-4778EN February 23, 2006
3
) and hydrochloric
3. Die Attach
a. Eutectic
AuSn preform with stage temperature of 310°C for one
minute max. AuGe preform with stage temperature of
390°C for one minute max.
b. Epoxy
For epoxy die-attach, conductive silver-filled or gold-
filled epoxies are recommended. This method can be
used for all Avago PIN chips.
4. Wire Bonding
Either ultrasonic or thermocompression bonding tech-
niques can be employed. Suggested wire is pure gold,
0.7 to 1.5 mil diameter.