CM300DX-12A Powerex Inc, CM300DX-12A Datasheet - Page 2

• Manufacturer Part Number: CM300DX-12A
• Description: IGBT MODULE NX-SERIES DUAL DP 1200 300
• Manufacturer: Powerex Inc
• Series: IGBTMOD™r

Specifications of CM300DX-12A

• Configuration: Half Bridge
• Voltage - Collector Emitter Breakdown (max): 600V
• Vce(on) (max) @ Vge, Ic: 2.1V @ 15V, 300A
• Current - Collector (ic) (max): 300A
• Current - Collector Cutoff (max): 1mA
• Input Capacitance (cies) @ Vce: 34nF @ 10V
• Power - Max: 960W
• Input: Standard
• Ntc Thermistor: Yes
• Mounting Type: Chassis Mount
• Package / Case: Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: BG2B-5015 - KIT DEV BOARD 2CN 5A FOR IGBTBG2B-3015 - KIT DEV BOARD 2CN 3A FOR IGBTBG2B-1515 - KIT DEV BOARD 1.5A FOR IGBTBG2A-NF - KIT DEV BOARD FOR IGBT
• Igbt Type: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone]
CM300DX-12A
Dual IGBTMOD™ NX-Series Module
300 Amperes/600 Volts
Absolute Maximum Ratings, T
Characteristics
Power Device Junction Temperature
Storage Temperature
Mounting Torque, M5 Mounting Screws
Mounting Torque, M6 Main Terminal Screws
Module Weight (Typical)
Baseplate Flatness, On Centerline X, Y (See Below)
Isolation Voltage, AC 1 minute, 60Hz Sinusoidal
Inverter Sector
Collector-Emitter Voltage (G-E Short)
Gate-Emitter Voltage (C-E Short)
Collector Current (T
Peak Collector Current (Pulse)
Emitter Current (T
Peak Emitter Current (Pulse)
Maximum Collector Dissipation (T
*1 Case temperature (T
*2 I
*3 Pulse width and repetition rate should be such that device junction temperature (T
*4 Junction temperature (T
BASEPLATE FLATNESS
MEASUREMENT POINT
E
, I
EM
, V
EC
, t
rr
and Q
C
C
= 25°C)
X
C
HEATSINK SIDE
= 56°C)
) and heatsink temperature (T
rr
j
) should not increase beyond T
represent ratings and characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
*1*4
*3
Y
– : CONCAVE
+ : CONVEX
*1
*3
C
= 25°C)
j
= 25°C unless otherwise specified
*1*4
f
) are defined on the surface of the baseplate and heatsink at just under the chip.
j(max
) rating.
CHIP LOCATION (TOP VIEW)
Chip Location (Top View)
18.6
28.2
0
IGBT
j
) does not exceed T
FWDi
47
48
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
1
NTC Thermistor
2
3
4 5
Symbol
V
V
I
V
Th
T
EM
I
I
P
CES
GES
—
—
—
—
CM
E
ISO
I
T
6
stg
j(max)
C
C
*2
j
7
*2
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22
rating.
Dimensions in mm (Tolerance: ±1mm)
CM300DX-12A
-40 to 150
-40 to 125
±0 ~ +100
2500
330
600
±20
300
600
300
600
960
31
40
24
23
Amperes
Amperes
Amperes
Amperes
Grams
Watts
29.8
40.9
18.6
Units
Volts
Volts
Volts
in-lb
in-lb
0
µm
°C
°C
Rev. 3/09