TFBS4711-TT1 Vishay, TFBS4711-TT1 Datasheet - Page 5

• Manufacturer Part Number: TFBS4711-TT1
• Description: IRDA TRANSCEIVER SIR SV-e4
• Manufacturer: Vishay
• Type: TX/RXr

Specifications of TFBS4711-TT1

• Peak Wavelength: 900nm
• Angle Of Half Sensitivity: 44°
• Pulse Width: 2us
• Communication Distance: 100
• Led Supply Voltage: -0.5 to 6V
• Package Type: SMD
• Fall Time: 100ns
• Rise Time: 100ns
• Dimensions: 6x3.1x1.9
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 6
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Data Rate: 115.2Kbps
• Idle Current, Typ @ 25° C: 75µA
• Link Range, Low Power: 1m
• Operating Temperature: -30°C ~ 85°C
• Orientation: Top View
• Shutdown: *
• Size: 6mm x 3.1mm x 1.9mm
• Standards: IrPHY 1.2
• Supply Voltage: 2.7 V ~ 5.5 V
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS4711 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 2 is VISHAY's recommended profiles for use with
the TFBS4711 transceivers. For more details please
refer to Application note: SMD Assembly Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Document Number 82633
Rev. 1.9, 07-Nov-06
260
240
220
200
180
160
140
120
100
80
60
40
20
Figure 1. Recommended Solder Profile for Sn/Pb soldering
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
250
90 s max.
300
19431
350
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Figure 2. Solder Profile, RSS Recommendation
50
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
Vishay Semiconductors
150
Time/s
200
50 s max.
20 s
TFBS4711
T peak = 260 °C max.
250
www.vishay.com
2 °C...4 °C/s
300
350
5