HDSM-531F Avago Technologies US Inc., HDSM-531F Datasheet - Page 8

DISPLAY, SEVEN SEGMENT, 14.22MM, YELLOW

HDSM-531F

Manufacturer Part Number
HDSM-531F
Description
DISPLAY, SEVEN SEGMENT, 14.22MM, YELLOW
Manufacturer
Avago Technologies US Inc.
Type
Moduler
Datasheet

Specifications of HDSM-531F

No. Of Digits / Alpha
1
Character Size
14.22mm
Led Color
Yellow
Common Connection
Common Anode
Luminous Intensity
20mcd
Forward Current If
20mA
Forward Voltage
2.1V
Number Of Digits/alpha
1
Size / Dimension
0.75" L x 0.49" W x 0.15" H (19.00mm x 12.50mm x 3.75mm)
Digit/alpha Size
0.56" (14.22mm)
Display Type
7-Segment
Common Pin
Common Anode
Color
Yellow
Voltage - Forward (vf) Typ
2.1V
Current - Test
10mA
Millicandela Rating
20mcd
Wavelength - Peak
591nm
Power Dissipation (max)
65mW
Package / Case
10-SMD
Number Of Digits
1
Illumination Color
Yellow
Operating Voltage
2.1 V
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Package Type
SMD
Product Length (mm)
12.5mm
Product Height (mm)
3.75mm
Product Depth (mm)
19mm
Digit Size (in)
.56in
Character Displayed
Numeric
Viewing Area Length (mm)
8.1mm
Viewing Area Height (mm)
14.22mm
Emitting Color
Yellow
Test Current (it)
10mA
Forward Current
25mA
Dominant Wave Length
589nm
Power Dissipation
65mW
Total Thickness
3.15mm
Reverse Voltage
5V
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Pin Count
10
Configuration
Common Anode
Number Of Elements
8
Peak Wavelength
591nm
Reverse Current
100uA
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Intensity Bin Limits (mcd)
Green
Tolerance: ±15%
Note:
1. Bin categories are established for classification of products. Prod-
SMT Soldering Profile
Pb free reflow soldering Profile
Notes:
1. The peak temperature refers to the peak package body tempera-
2. Number of reflow process shall be limited to maximum 2 times only.
8
IV Bin Category
M
N
P
Q
ucts may not be available in all categories. Please contact your
Avago representative for information on currently available bins.
ture.
Cooling process to normal temperature is required between first
and second soldering process.
217°C
200°C
150°C
3°C/SEC. MAX.
3°C/SEC. MAX.
60 - 120 SEC.
Min.
5.401
8.601
21.801
13.701
245°C
TIME
(Acc. to J-STD-020C)
10 - 30 SEC.
100 SEC. MAX.
Max
8.600
13.700
21.800
34.700
6°C/SEC. MAX.
Yellow / Red / Orange
Tolerance: ±15%
Recommended soldering pattern (unit: mm)
IV Bin Category
N
P
Q
R
Recommended stencil window opening is 80%
1.8
3
2.45 x 4 = 9.8
Min.
8.601
13.701
21.801
34.701
16
Max
13.700
21.800
34.700
55.200

Related parts for HDSM-531F