HLMP-4700-C0002 Avago Technologies US Inc., HLMP-4700-C0002 Datasheet - Page 9
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HLMP-4700-C0002
Manufacturer Part Number
HLMP-4700-C0002
Description
LED, T-1 3/4, RED, 1.2MCD, 626NM
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HLMP-1790-A0002.pdf
(10 pages)
Specifications of HLMP-4700-C0002
Bulb Size
T-1 3/4 (5mm)
Led Color
Red
Luminous Intensity
2.3mcd
Viewing Angle
50°
Forward Current If
2mA
Forward Voltage
1.7V
Led Mounting
Through Hole
Lens Shape
Round
Wavelength Typ
626nm
Color
Red
Millicandela Rating
2.3mcd
Current - Test
2mA
Wavelength - Dominant
626nm
Wavelength - Peak
635nm
Voltage - Forward (vf) Typ
1.7V
Lens Type
Diffused, Red Tinted
Lens Style/size
Round, 5mm, T-1 3/4
Package / Case
Radial - 2 Lead
Height
8.81mm
Mounting Type
Through Hole
Resistance Tolerance
626nm
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HLMP-4700-C0002
Manufacturer:
AVAGO
Quantity:
40 000
Company:
Part Number:
HLMP-4700-C0002
Manufacturer:
AVAGO
Quantity:
50 000
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
Example of Wave Soldering Temperature Profile for TH LED
9
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
250
(1P) Item: Part Number
(V) Vendor ID:
200
150
100
50
0
Lamps Baby Label
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
QUANTITY: Packing Quantity
RoHS Compliant
e3
max temp 250C
70
max temp 250C
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.