TEMT6000 Vishay, TEMT6000 Datasheet - Page 3
![TRANSISTOR, PHOTO, 570NM, SMD](/photos/22/89/228930/4466154_sml.jpg)
TEMT6000
Manufacturer Part Number
TEMT6000
Description
TRANSISTOR, PHOTO, 570NM, SMD
Manufacturer
Vishay
Datasheet
1.TEMT6000.pdf
(6 pages)
Specifications of TEMT6000
Wavelength Typ
570nm
Power Consumption
100mW
Viewing Angle
60°
No. Of Pins
3
Power Dissipation Pd
100mW
Collector Emitter Saturation Voltage Vce(sat)
0.1V
Length/height, External
1.05mm
Voltage, Vcc
5V
Spectral Response Peak Wavelength
570nm
Half Sensitivity Angle ±
60°
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TEMT6000
Manufacturer:
OPTEK
Quantity:
1 000
Company:
Part Number:
TEMT6000X01
Manufacturer:
Vishay Semiconductors
Quantity:
135
Company:
Part Number:
TEMT6000X01
Manufacturer:
COTO
Quantity:
10 000
Part Number:
TEMT6000X01
Manufacturer:
VISHAY/威世
Quantity:
20 000
Reflow Solder Profiles
Document Number 81579
Rev. 1.3, 28-Nov-06
19030
Figure 5. Relative Spectral Sensitivity vs. Wavelength
300
250
200
150
100
280
260
240
220
200
180
160
140
120
100
50
80
60
40
20
0
Figure 7. Tin (Sn) Reflow Solder Profile (Pb-free)
0
Figure 8. Lead Tin (SnPb) Reflow Solder Profile
0
0
20019
max. 240 °C ca. 230 °C
125 °C
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
30
300 400 500 600 700 800 900 1000 1100
2 K/s - 4 K/s
50
60
90
Preheat
260 °C
90 s - 120 s
max. 160 °C
120 s
λ - Wavelength (nm)
120
100
Time (s)
Time (s)
215 °C
145 °C
210 °C
250 °C
150
Reflow
180
full line
dotted
150
~
~
10 s
Lead Temperature
30 s
40 s
max 40s
210
~
20 s
: typical
:process limits
Cooling
240
200
270
948625
250
300
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a de-
siccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. TEMT6000 is released for:
Moisture Sensitivity Level 4, according to JEDEC,
J-STD-020
Floor Life: 72 h
Conditions: T
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (+ 5 °C), RH < 5 %
Figure 6. Relative Radiant Sensitivity vs. Angular Displacement
94 8318
1.0
0.9
0.8
0.7
0.6
amb
0.4
< 30 °C, RH < 60 %
0.2
Vishay Semiconductors
0°
0
TEMT6000
0.2
10°
0.4
20°
www.vishay.com
0.6
30°
40°
50°
60°
70°
80°
3