CNY17F-3X001 Vishay, CNY17F-3X001 Datasheet - Page 16

• Manufacturer Part Number: CNY17F-3X001
• Description: Optocoupler
• Manufacturer: Vishay

Specifications of CNY17F-3X001

• Leaded Process Compatible: Yes
• Forward Current: 60 mA
• Maximum Input Diode Current: 60 mA
• Maximum Reverse Diode Voltage: 6 V
• Output Device: Transistor
• Output Type: DC
• Configuration: 1
• Input Type: DC
• Maximum Collector Emitter Voltage: 70 V
• Maximum Collector Emitter Saturation Voltage: 400 mV
• Isolation Voltage: 5300 Vrms
• Current Transfer Ratio: 200 %
• Maximum Forward Diode Voltage: 1.65 V
• Maximum Collector Current: 100 mA
• Maximum Power Dissipation: 150 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• Package / Case: PDIP-6
• No. Of Channels: 1
• Optocoupler Output Type: Phototransistor
• Input Current: 60mA
• Output Voltage: 70V
• Opto Case Style: DIP
• No. Of Pins: 6
• Approval Bodies: UL, IEC65, IEC950, BS6301,
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Option Information
Vishay Semiconductors
OPTION 8
LEAD
OPTOCOUPLERS
These optocouplers are suitable for surface mounting.
Dimensions deviating from the standard type are:
Creepage distance > 8.0 mm
Clearance distance > 8.0 mm
This version additionally complies with the following
standards:
• IEC 60950 DIN VDE 0805/05 90 (system 2 and 3 only)
During the soldering process, the package should not be
wetted with tin-lead solder to prevent the impairment of the
isolation features. Apart from iron soldering, only reflow
soldering methods (vapor phase, infrared and hot gas) are
permissible.
Permissible soldering conditionsfor SMD bending options:
please see reflow soldering profile
The soldering process may be repeated two times at the
most. Attention must be paid to the cooling down of the
device to 25 °C between the soldering processes
Clearance and creepage distances must be considered for
the solder pad design.
Clearance-creepage distance = 8.0 min.
See standard version for pin configuration.
OPTION 9
LEAD BENDS FOR SURFACE MOUNT
OPTOCOUPLERS
During the soldering process, the package should not be
wetted with tin-lead solder to prevent the impairment of the
isolation features. Apart from iron soldering, only reflow
soldering methods (vapor phase, infrared and hot gas) are
www.vishay.com
6
0.020 (0.50)
0.000 (0.00)
0.000 (0.00)
0.020 (0.50)
17932
Reinforced insulation up to an operating voltage of
400 V
RMS
BENDS
or DC
0.47 2 (12.00)
0.47 2 (12.00)
0.365 (9.27)
0.365 (9.27)
0.300 (7.62)
0.300 (7.62)
min.
min.
typ.
max.
typ.
max.
FOR
0.150 (3.81)
0.130 (3.30)
0.150 (3.81)
0.130 (3.30)
SURFACE
For technical questions, contact: [e-mail]
0.015 (0.38)
0.020
(0.5)
typ.
DIP 6
DIP 4
0.020(0.5)
0.05 (1.27)
0.040(1.02)
MOUNT
typ.
0.016 (0.4)
0.031 (0.79)
Option Information
typ.
permissible.
Permissible soldering conditionsfor SMD bending options:
please see reflow soldering profile
The soldering process may be repeated two times at the
most. Attention must be paid to the cooling down of the
device to 25 °C between the soldering processes.
MARKINGS
The following table defines the option information that is
marked on the product.
0.0098 (0.249)
0.0040 (0.102)
17933
0.015 (0.38)
OPTION TYPE
X001, X001T
X007, X007T
X008, X008T
X009, X009T
X017, X017T
X018, X018T
X019, X019T
typ.
X006
X016
DIP4/ 8/16
0.050 (1.27)
0.040 (1.02)
0.020 (0.51)
0.395 (10.03 )
0.375 (9.53)
0.300 (7.62)
typ.
0.016 (0.4)typ.
0.031(0.79)
ref.
0.020
(0.5)
typ.
Document Number: 83713
DIP 6
MARKING
No mark
No Mark
Rev. 1.7, 11-Sep-07
X001
X007
X008
X001
X017
X018
X001
0.012 (0.30) typ.
15° m ax.
0.020 (0.5)
0.040 (1.02)