HDSP-U203 Avago Technologies US Inc., HDSP-U203 Datasheet - Page 10

• Manufacturer Part Number: HDSP-U203
• Description: Seven-Segment Numeric LED Display,1-CHARACTER,Red,DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HDSP-U203

• Number Of Digits/alpha: 1
• Size / Dimension: 0.43" L x 0.28" W x 0.20" H (11.00mm x 7.10mm x 5.00mm)
• Digit/alpha Size: 0.31" (7.87mm)
• Display Type: 7-Segment
• Common Pin: Common Cathode
• Color: Red
• Voltage - Forward (vf) Typ: 2V
• Current - Test: 20mA
• Millicandela Rating: 5.39mcd
• Wavelength - Peak: 635nm
• Power Dissipation (max): 105mW
• Package / Case: 10-DIP (0.209", 5.03mm)
• Number Of Digits: 1
• Illumination Color: Red
• Operating Current: 5 mA
• Luminous Intensity: 980 ucd
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

10
Yellow
Color Categories
Note:
All categories are established for classification of products. Products
may not be available in all categories. Please contact your local Avago
representatives for further clarification/information.
Green
IV Bin Category
IV Bin Category
Yellow
Color
Green
B
C
D
E
G
H
F
H
K
L
J
I
Bin
1
3
2
4
2
3
4
5
HDSP-U3xx
HDSP-U5xx
Dominant Wavelength (nm)
581.50
584.00
586.50
589.00
573.00
570.00
567.00
564.00
0.229
0.317
0.476
0.714
1.073
1.609
2.413
Min.
Min.
0.86
1.29
1.94
2.90
4.37
Min.
585.00
587.50
590.00
592.50
577.00
574.00
571.00
568.00
0.387
0.582
0.872
1.311
1.967
2.950
4.425
Max.
Max.
Max.
1.58
2.37
3.55
5.33
8.01
Electrical/Optical
For more information on
electrical/optical characteristics,
please see Application Note 1005.
Contrast Enhancement
For information on contrast
enhancement, please see
Application Note 1015.
Soldering/Cleaning
Cleaning agents from the ketone
family (acetone, methyl ethyl
ketone, etc.) and from the
chorinated hydrocarbon family
(methylene chloride, trichloro-
ethylene, carbon tetrachloride,
etc.) are not recommended for
cleaning LED parts. All of these
various solvents attack or dissolve
the encapsulating materials used
to form the package of plastic
LED parts.
For more information on
soldering LEDs, please refer to
Application Note 1027.