658-60ABT1E Wakefield Thermal Solutions, 658-60ABT1E Datasheet - Page 19
658-60ABT1E
Manufacturer Part Number
658-60ABT1E
Description
Pin Fin Heat Sink For BGA Packages And PowerPC
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-60ABT1E
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Dimensions
27.9 mm L x 27.9 mm W x 15.2 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Color
Black
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
18 x 18 PGA
17 x 17 SPGA
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