233-60AB Wakefield Thermal Solutions, 233-60AB Datasheet - Page 23

• Manufacturer Part Number: 233-60AB
• Description: Heat Sink
• Manufacturer: Wakefield Thermal Solutions
• Series: 233r

Specifications of 233-60AB

• Packages Cooled: TO-220
• Thermal Resistance: 58°C/W
• Heat Sink Material: Aluminum
• Color: Black
• Package Cooled: TO-220
• Attachment Method: Bolt On
• Outline: 14.48mm x 12.70mm
• Height: 0.600" (15.20mm)
• Power Dissipation @ Temperature Rise: 2W @ 58°C
• Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM
• Thermal Resistance @ Natural: 29°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 13.21 mm L x 12.7 mm W x 19.05 mm H
• Designed For: TO-220
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 345-1014

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Use these low-height heat sinks on printed circuit board applications for TO-66 power semi-
conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
tion with an optimized heat sink surface area. The 641K type with an open channel area of
44
MECHANICAL
DIMENSIONS
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
(EXTRUSION PROFILE 1284)
6/14/07
601 SERIES
Standard
P/N
601E
601F
601K
603K
Material: Aluminum Alloy, Black Anodized
Standard
P/N
641A
641K
601 & 603 SERIES
641 SERIES
10:56 AM
(EXTRUSION PROFILE 1371)
641 SERIES
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 2.000 (50.8)
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Page 44
Dimensions
Dimensions
in. (mm)
Footprint
in. (mm)
Outline
K
Low-Height Heat Sinks
1.000 (25.4)
1.000 (25.4)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
in. (mm)
in. (mm)
SEMICONDUCTOR MOUNTING HOLES
Height
Height
(EXTRUSION PROFILE 1284)
SEMICONDUCTOR MOUNTING HOLES
603 SERIES
A
dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or
brackets using isolation hardware where necessary.
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black An-
odized.
E
Mounting
(1) TO-3
0.200 (5.1)
0.270 (6.9)
Mounting
Pattern
Hole Dia.
in. (mm)
None
Hole
None
None
K
52°C @ 5.0W
52°C @ 5.0W
52°C @ 5.0W
41°C @ 5.0W
Thermal Performance at Typical Load
Convection
36°C @ 15W
36°C @ 15W
Convection
Natural
Thermal Performance at Typical Load
Natural
CONVECTION CHARACTERISTICS
F
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.0°C/W @ 175 LFM
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
NATURAL AND FORCED
Convection
Convection
Forced
Forced
DO-4/DO-5 Diodes
0.2900 (131.54)
0.2900 (131.54)
0.0500 (22.68)
0.0500 (22.68)
0.0500 (22.68)
0.0810 (36.74)
lbs. (grams)
lbs. (grams)
Weight
Weight
TO-3