274-3AB Wakefield Thermal Solutions, 274-3AB Datasheet - Page 16

• Manufacturer Part Number: 274-3AB
• Description: Heat Sink
• Manufacturer: Wakefield Thermal Solutions

Specifications of 274-3AB

• Packages Cooled: TO-220
• Thermal Resistance: 31°C/W
• Width: 13.2mm
• Height: 6.4mm
• Heat Sink Material: Aluminum
• Length: 19.1mm
• Mounting Type: Mounting Hole
• Package / Case: TO-220
• Color: Black
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Dimensions: 13.2 mm L x 19.1 mm W x 6.4 mm H
• Designed For: TO-220
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5346208

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”
Base Mounting Configurations — TO-5
Plain Type — Epoxy bonded, or used with #4 pan head screws.
Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care should
be taken not to use too long a screw, which could short against the semicon-
ductor case. For correct screw lengths:
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud hole
must be slightly countersunk to ensure flat mounting.
260 SERIES
Characteristics
Thermal Resistance – Epoxy Insulated
Breakdown Voltage – Epoxy Type (VAC), 60 Hz
Recommended Operating Voltage, AC or DC
Temperature Range — Continuous (C°)
TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE
Standard
P/N
260-4T5E
260-4TH5E
260-6SH5E
Dimensions: in. (mm)
MECHANICAL
DIMENSIONS
Clean Conditions: % Hipot Rating
Dusty Conditions: % Hipot Rating
Dirty Conditions: % Hipot Rating
6/14/07
10:55 AM
Cup Clips for TO-5 Case Style Semiconductors
Epoxy Insulated
Epoxy Insulated
Epoxy Insulated
Standard
P/N
695-1B
Mount and effectively heat sink small stud-mounted diodes with the 695 Series
space-saving heat sink type. Each unit is black anodized aluminum with an
0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
695 SERIES
Insulation
Type
Page 37
Space-Saving Heat Sinks for Small Stud-Mounted Diodes
1.330 (33.8)
0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)
0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)
Maximum
in. (mm)
0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)
-73/+149
Width
14° C/W
10 to 20
TO-5
500
50
30
Outline Dimension
L x W x I.D.
Thread
Size:
Mounting
Style:
in. (mm)
Model
260-4T5E
260-4TH5E
0.530 (13.7)
695 SERIES
in. (mm)
Height
S = stud
P = plain
4 = #4-40 UNC
6 = #6-32 UNC
T = tapped
Tapped Base
0.093 (2.36)
0.125 (3.18)
Depth of
72°C @ 4.0W
To determine the correct mounting screw lengths, add dimensions as follows:
Correct Screw Length (L) =
0.0024 (1.09)
0.0031 (1.41)
0.0037 (1.68)
Convection
lbs. (grams)
Thermal Performance at Typical Load
Natural
provides good heat dissipation for use where height is limited above the printed
circuit board or base plate.
Semiconductor
Weight
Base Style: H = hex
Case Style: 5 = TO-5
Insulation E = epoxy
Case
Style
TO-5
TO-5
TO-5
CONVECTION CHARACTERISTICS
Depth of Base + Panel Thickness + Washer Thickness
5.2°C/W @ 400 LFM
NATURAL AND FORCED
Convection
Forced
Board Level
Heat Sinks
STUD-MOUNT
lbs. (grams)
0.008 (4.0)
TO-5
Weight
37