423A Wakefield Thermal Solutions, 423A Datasheet

Heat Sink

423A

Manufacturer Part Number
423A
Description
Heat Sink
Manufacturer
Wakefield Thermal Solutions
Datasheets
1.637-10ABP.pdf (8 pages)
2.528-24AB.pdf (7 pages)

Specifications of 423A

Packages Cooled
TO-3
Thermal Resistance
47°C/W
Width
120.7mm
Height
66.7mm
Heat Sink Material
Aluminum
Length
140.2mm
Mounting Type
Screw
Package / Case
TO-3
Color
Black
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Extruded
Dimensions
140.2 mm L x 120.7 mm W x 66.7 mm H
Designed For
TO-3, DO-5, Stud Mounted Semiconductor Cases
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case
power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find
a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.)
All other products, please contact factory for price, delivery, and minimums.
tion with an optimized heat sink surface area. The 641K type with an open channel area of
The large fin area in minimum total volume provided by the radial design of the 301/302/303
Series offers maximum heat transfer efficiency in natural convection. All types are available
with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
Extruded
Heat Sinks
MECHANICAL
DIMENSIONS
MECHANICAL
DIMENSIONS
MECHANICAL
DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
301 SERIES
621 AND 623 SERIES
Standard
P/N
621A
621K
623A
623K
301/302/303 SERIES
Standard
P/N
301K
301M
301N
302M
302MM
302N
302NN
303M
303MM
303N
303NN
641 SERIES
Standard
P/N
641A
641K
(EXTRUSION PROFILE 1371)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
641 SERIES
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 3.000 (76.2)
4.750 (120.6) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Dimensions
in. (mm)
Outline
SERIES
Dimensions
301
302
303
Footprint
Dimensions
in. (mm)
in. (mm)
Outline
302 AND 303 SERIES
Low-Profile Heat Sinks for All Metal-Case Power Semiconductors
Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases
621 AND 623 SERIES (EXTRUSION PROFILE 1327)
0.750 (19.1)
0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth
0.750 (19.1) (1)
1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (1)
1.500 (38.1) (2)
3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (1)
3.000 (76.2) (2)
Length “A”
in. (mm)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
1.000 (25.4)
1.000 (25.4)
in. (mm)
Height
in. (mm)
Height
1
1
1
1
⁄
1
SEMICONDUCTOR MOUNTING HOLES
⁄
⁄
⁄
⁄
K
4
4
4
4
4
SEMICONDUCTOR MOUNTING HOLES
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
50
Pattern and Number
A
in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the
standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and
“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black
Anodized.
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black
Anodized.
Hole Pattern
SEMICONDUCTOR MOUNTING HOLES
Mounting
(1) TO-3
(1) TO-3
Mounting
Hole (s)
None
None
None
Mounting
(1) TO-3
Pattern
A
None
Hole
M
K
75°C @ 15W
75°C @ 15W
52°C @ 15W
52°C @ 15W
Convection
Thermal Performance at Typical Load
Natural
36°C @ 15W
36°C @ 15W
K
Convection
Thermal Performance at Typical Load
Natural
Thermal Performance at Typical Load
5O°C @ 15W
N
70°C @ 15W
70° C @ 15W
70° C @ 15W
50° C @ 15W
50°C @ 15W
50°C @ 15W
37° C @ 15W
37° C @ 15W
37° C @ 15W
37° C @ 15W
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
2.0°C/W @ 250 LFM
2.0°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
2.5° C/W @ 250 LFM
2.5° C/W @ 250 LFM
2.5° C/W @ 250 LFM
1.8° C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8° C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
Convection
Forced
Convection
Convection
Forced
Forced
0.2900 (131.54)
0.2900 (131.54)
Normally stocked
STUD-MOUNT
0.1000 (45.36)
0.2100 (95.26)
0.210O (95.26)
lbs. (grams)
0.1000 (45.36)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.0580 (26.31)
0.0580 (26.31)
0.0580 (26.31)
0.1330 (60.33)
0.1330 (60.33)
0.1330 (60.33)
lbs. (grams)
0.1330 (6033)
lbs. (grams)
Weight
TO-3
Weight
TO-3
Weight

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423A Summary of contents

Page 1

... The large fin area in minimum total volume provided by the radial design of the 301/302/303 Series offers maximum heat transfer efficiency in natural convection. All types are available with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the ...

Page 2

... Space-saving double surface 413, 421, and 423 Series utilize finned surface area on both sides of the power semiconductor mounting surface to provide maximum heat dissipation in a compact profile. Ready to install on popular power components in natural and forced convection applications ...

Page 3

... Designed for vertical mounting within a power supply enclosure or equipment cabinet without forced airflow available. This Wakefield 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection with a maximum 55°C heat sink temperature rise above ambient. When applied in a forced Dimensions: in ...

Page 4

... LFM (19.4)Dia. NATURAL AND FORCED CONVECTION CHARACTERISTICS Mounting Thermal Performance at Typical Load Hole Pattern Natural Convection Forced Convection None 24° 50W 0.20° C/W @250 LFM 86° 250W 0.13° C/W @500 LFM None 19° 50W 0.15° ...

Page 5

... GENERAL PURPOSE Thermal Performance at Typical Load Natural Convection Forced Convection 84° 20OW 0.18° C/W @ 600 LFM 60° 20OW 0.13° C/W @ 600 LFM 45° 20OW 0.09° C/W @ 600 LFM ...

Page 6

... Teflon #6-32 screw, nut Teflon 107 SERIES 55 All other products, please contact factory for price, delivery, and minimums. Extruded Heat Sinks TO-220 and TO-218 Thermal Performance Natural Convection Forced Convection Thermal Resistance at 300 ft/min 11W 2.0 °C/W 7W 3.2 °C/W 5W 5.8 °C/W 11W 2.0 ° ...

Page 7

... Nonmilled base flatness: 0.006 in./in. 3. Natural convection heat dissipation for distributed heat rces at 50°C rise. Flatness Thermal Resistance at Typical Load Natural Gold Length Convection (Øsa) Iridite in. (mm) (° ...

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