MC33264 MULTICOMP, MC33264 Datasheet

MC33264

Manufacturer Part Number

MC33264

Description

Heat Sink

Manufacturer

MULTICOMP

Datasheet

1.MC33296.pdf (1 pages)

Specifications of MC33264

Packages Cooled

TO-220

Thermal Resistance

11Â°C/W

Width

34.9mm

Height

38.1mm

Length

12.7mm

Mounting Type

PC Board Thru Hole

Package / Case

TO-220

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

MC33264D-3.3G

Manufacturer:

ON/安森美

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MC33264D-3.3R2

Manufacturer:

SONY

Quantity:

Current page: 1 of 1
Download datasheet (117Kb)

Clip 4

Heatsink Extruded

Mfg Part No:

MC33296

Mfg Part No:

MC33263

MC33264

Compact, vertical mounting extruded heatsink

with solderable fixing pins. Designed for a single

TO220 package via clip available separately or

mounting holes.

Product Features:

•

http://www.farnell.com

http://www.newark.com

http://www.cpc.co.uk

Screw or clip mount

Solderable mounting pins

Black anodize finish

Description:

Clip 4

Thermal Resistance:

13.4

10.4

C/W

Height (mm):

25.4

38.1

Device Mtg:

Clip 4

1 /

0 /

1 .

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