H-2703-05-9000-05-A EMULATION TECHNOLOGY, H-2703-05-9000-05-A Datasheet
H-2703-05-9000-05-A
Manufacturer Part Number
H-2703-05-9000-05-A
Description
Heat Sink
Manufacturer
EMULATION TECHNOLOGY
Datasheet
1.H-2703-05-9000-05-A.pdf
(1 pages)
Specifications of H-2703-05-9000-05-A
Packages Cooled
BGA
Thermal Resistance
15.5°C/W
Height
7.62mm
Peak Reflow Compatible (260 C)
Yes
Leaded Process Compatible
Yes
Mounting Type
Snap-On
Package / Case
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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