RTV-615 CLEAR 1# MOMENTIVE PERFORMANCE MATERIALS, RTV-615 CLEAR 1# Datasheet - Page 3
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RTV-615 CLEAR 1#
Manufacturer Part Number
RTV-615 CLEAR 1#
Description
SILICONE 2 PART ADHESIVE, 1LB
Manufacturer
MOMENTIVE PERFORMANCE MATERIALS
Series
RTV-615r
Datasheet
1.IS-808-2.8.pdf
(40 pages)
Specifications of RTV-615 CLEAR 1#
Adhesive Type
Silicone - 2 Part
Color
Clear
Weight
1lb
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
APPLICATIONS
APPLICATIONS
SEALING & ADHESION
COATING
The Coating process involves the
application of silicone in a thin
protective layer to a component
surface by methods such as
dip, flow, spray, and selective
robotic coating. Selection of a
silicone coating material for a
particular application involves
the consideration of various
performance and processing
criteria.
POTTING & ENCAPSULATION
Silicones are used in a wide array of applications for bonding components,
and sealing against moisture or environmental contaminants.
comprehensive portfolio of 1 Part and 2 Part Adhesives and Sealants,
many of which are excellent candidates for assembly applications on or
near sensitive electrical and electronic components, are available.
materials are applied by a variety of methods ranging from manual
dispensing to auto-dispensing units for tube, cartridge, pail, or drum packages.
may be accomplished by either manual processes or meter mix dispensing, depending on production
volume and post-mix material properties.
Silicone rubber and gels are widely used in electronics to ensure
mechanical and environmental protection. A full range of products
- Temperature Resistance - Dielectric Resistance
- Flame Retardancy
- Adhesion
- Hardness
Performance Considerations
are offered in various cure speeds,
viscosities, and performance, many of
which offer enhancements for thermal
cycling protection, stress relief, material
strength, flame retardancy, or optical
clarity.
- Low Volatility
- Mechanical Strength
- Thermal Conductivity
- Viscosity
- Cure Temperature
- Pot Life
These
- Temperature Resistance
- Flame Retardancy
- Adhesion
- Release Properties
- Temperature Resistance
- Flame Retardancy
- Stress Relief
Process Considerations
- Viscosity
- Cure Temperature
- Pot Life
- Viscosity
- Cure Temperature
- Pot Life
A
Performance Considerations
Performance Considerations
Process Considerations
Process Considerations
Mixing for 2 Part grades
- Cure Mechanism
- Cure Time
- Dielectric Resistance
- Low Volatility
- Stress Relief
- Thermal Conductivity
- Dielectric Resistance
- Low Volatility
- Cure Mechanism
- Cure Time
- Cure Mechanism
- Cure Time
2