75005-0304 Molex Inc, 75005-0304 Datasheet - Page 7
![HS Mezz Rec Assy 4.5mm 6 Pr C-Peg](/photos/1/80/18067/75005-0304_sml.jpg)
75005-0304
Manufacturer Part Number
75005-0304
Description
HS Mezz Rec Assy 4.5mm 6 Pr C-Peg
Manufacturer
Molex Inc
Series
Plateau HS Mezz™ 75005r
Datasheets
1.75005-0306.pdf
(7 pages)
2.75005-0306.pdf
(9 pages)
3.75005-0306.pdf
(12 pages)
4.75005-0304.pdf
(3 pages)
Specifications of 75005-0304
Connector Type
Differential Pair Array, Female
Number Of Positions
12
Pitch
0.047" (1.20mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
10mm, 13mm, 15mm
Height Above Board
0.285" (7.24mm)
Product Type
Receptacles
Mounting Style
Wire
Mounting Angle
Vertical
Number Of Positions / Contacts
18
Housing Material
High Temperature Thermoplastic
Contact Material
High Performance Alloy (HPA)
Contact Plating
Gold
Voltage Rating
30 V
Current Rating
1.5 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
075005-0304
0750050304
750050304
SD-75005-001
WM17202TR
0750050304
750050304
SD-75005-001
WM17202TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
75005-0304
Manufacturer:
Molex Connector Corporation
Quantity:
3 000
REVISION:
DOCUMENT NUMBER:
C
5.4 Inspection:
NOTE: The Ground Peg has been tested and qualified without protruding below the surface of the PCB. This
AS-75005-001
ECR/ECN INFORMATION:
EC No:
DATE:
connector uses a Pin-thru-Paste application and only requires that >50% of the peg is covered with
solder with a solder fillet at the top.
UCP2003-2204
2003 / 04 / 09
APPLICATION SPECIFICATION
HIGH SPEED MEZZANINE
TITLE:
CREATED / REVISED BY:
Ken Stiles
Best Case 100% Peg Coverage
Worst Case 50% Peg Coverage
BOARD TO BOARD CONNECTOR SYSTEM
APPLICATION SPECIFICATION FOR THE
Nominal 0.072(1.83mm) thick board
Nominal 0.072(1.83mm) thick board
With 50% Hole Fill.
With 50% Hole Fill.
A good solder joint requires 50% Peg Coverage MIN.,
A good solder joint requires 50% Peg Coverage MIN.,
with a solder fillet at the top of the joint.
with a solder fillet at the top of the joint.
Nominal 0.062(1.57mm) thick board
Nominal 0.062(1.57mm) thick board
With 100% Peg Coverage.
With 100% Peg Coverage.
A good solder joint requires 50% Peg Coverage MIN.,
A good solder joint requires 50% Peg Coverage MIN.,
with a solder fillet at the top of the joint.
with a solder fillet at the top of the joint.
Solder Fillet
Solder Fillet
HIGH SPEED MEZZANINE
Solder Fillet
Solder Fillet
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Manny Banakis
APPROVED BY:
SHEET No.
7
of
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