04023J0R2ABSTR AVX Corporation, 04023J0R2ABSTR Datasheet - Page 18
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04023J0R2ABSTR
Manufacturer Part Number
04023J0R2ABSTR
Description
CAPACITOR, ACCU-P 0.2PF 25V 0402CAPACITOR, ACCU-P 0.2PF 25V 0402
Manufacturer
AVX Corporation
Series
ACCUPr
Datasheet
1.04023J0R2ABSTR.pdf
(20 pages)
Specifications of 04023J0R2ABSTR
Capacitance
0.2PF
Voltage Rating, Dc
25V
Capacitor Dielectric Type
CERAMIC MULTI-LAYER
Tolerance,
25%
Tolerance, -
25%
Temp, Op. Max
125(DEGREE
Rohs Compliant
YES
Tolerance
0.05 pF
Voltage Rating
25 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
C0G (NP0)
Package / Case
0402 (1005 metric)
Product
RF Microwave MLCCs
Dimensions
0.022 in W x 0.039 in L x 0.016 in H
Termination Style
SMD/SMT
Lead Free Status / Rohs Status
Details
1
Accu-F
Application Notes
GENERAL
Accu-F
soldering to printed circuit boards or other substrates. The
construction of the components is such that they will with-
stand the time/temperature profiles used in both wave and
reflow soldering methods.
CIRCUIT BOARD TYPE
The circuit board types which may be used with Accu-F
Accu-P
For other circuit board materials, please consult factory.
WAVE SOLDERING
DIMENSIONS:
REFLOW SOLDERING
DIMENSIONS:
22
(0.042)
1.06
Accu-F
Accu-P
(0.030)
0.78
(0.016)
Accu-P
0.40
(0.010)
0201
(0.016)
0.26
0.40
Accu-P
(0.010)
0.26
0201
®
®
®
®
are as follows:
and Accu-P
: All flexible types of circuit boards
: All flexible types of circuit boards
®
(eg. FR-4, G-10).
(eg. FR-4, G-10) and also alumina.
(0.010)
®
0.26
(0.013)
0.34
(0.010)
0.26
(0.013)
0.34
®
millimeters (inches)
millimeters (inches)
(0.083)
®
2.1
(0.068)
Accu-P
/ Accu-P
1.7
SMD capacitors are designed for
(0.031)
(0.031)
0.8
0402
0.8
Accu-P
(0.020)
(0.024)
(0.024)
0402
0.5
0.6
0.6
(0.022)
(0.020)
0.55
0.5
®
(0.022)
0.55
®
(0.091)
(0.122)
2.3
3.1
Accu-F
(0.047)
(0.047)
Accu-F
0603
1.2
1.2
(0.031)
(0.028)
(0.031)
0603
0.8
(0.028)
0.7
0.8
0.7
(0.031)
®
(0.031)
0.8
®
0.8
®
®
and
(0.122)
(0.091)
2.3
3.1
Accu-P
(0.049)
(0.049)
1.25
1.25
Accu-P
0603
(0.033)
(0.024)
(0.033)
0.85
0.85
0603
0.6
(0.024)
HANDLING
SMD capacitors should be handled with care to avoid damage
or contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly recom-
mended for individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized. For
automatic equipment, taped and reeled product gives the
ideal medium for direct presentation to the placement
machine.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good
joints and minimize component movement during reflow
soldering. Pad designs are given below for both wave and
reflow soldering.
The basis of these designs is:
0.6
(0.031)
(0.031)
a. Pad width equal to component width. It is permissible to
b. Pad overlap 0.5mm beneath large components. Pad
c. Pad extension of 0.5mm for reflow of large components
0.8
0.8
®
®
decrease this to as low as 85% of component width but
it is not advisable to go below this.
and pad extension about 0.3mm for reflow of small com-
ponents. Pad extension about 1.0mm for wave soldering.
overlap about 0.3mm beneath small components.
(0.157)
(0.118)
4.0
3.0
(0.039)
(0.039)
(0.039)
(0.059)
(0.039)
(0.059)
1.0
1.0
1.0
1.5
1.0
1.5
Accu-F
Accu-P
0805
Accu-F
Accu-P
0805
(0.049)
1.25
(0.049)
®
®
1.25
®
®
(0.197)
(0.157)
5.0
4.0
(0.059)
(0.079)
(0.059)
(0.039)
(0.079)
(0.039)
1.5
1.5
2.0
1.0
2.0
1.0
Accu-P
1210
Accu-P
1210
(0.098)
2.5
®
(0.098)
2.5
®