VR37000002205JR500 Vishay, VR37000002205JR500 Datasheet - Page 4

• Manufacturer Part Number: VR37000002205JR500
• Description: RESISTOR, METAL GLAZE, 22 MOHM, 500 MW, ± 5%
• Manufacturer: Vishay
• Series: VR37r

Specifications of VR37000002205JR500

• Resistance: 22Mohm
• Resistance Tolerance: ± 5%
• Power Rating: 500mW
• Voltage Rating: 3.5kV
• Resistor Element Material: Metal Foil
• Temperature Coefficient: ± 200ppm/K
• Resistance (ohms): 22M
• Power (watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Tolerance: ±5%
• Size / Dimension: 0.157" Dia x 0.394" L (4.00mm x 10.00mm)
• Lead Style: Through Hole
• Package / Case: Axial
• Resistance In Ohms: 22M
• Case: Axial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Height: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: PPCHHJ22MTR

Application Information
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days).
The tests are carried out in accordance with IEC 60068-2-xx.
Test method under standard atmospheric conditions
according to IEC 60068-1, 5.3.
Document Number: 28733
Revision: 12-Oct-09
Hot-spot temperature rise (ΔT) as a function of dissipated power
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
4.16
4.16.2
4.16.3
4.16.4
4.17
4.18
4.19
Δ T
(K)
80
60
40
20
0
0
METHOD
60068-2-
21 (Ua1)
21 (Ub)
14 (Na)
21 (Uc)
20 (Tb)
20 (Ta)
TEST
IEC
0.4
Rapid change of temperature
Robustness of terminations:
Bending half number
Tensile all samples
Torsion other half
soldering heat
Resistance to
Solderability
Solderability
(after aging)
For technical questions, contact:
of samples
of samples
TEST
0.8
Metal Glaze Leaded Resistors
P (W)
High Ohmic/High Voltage
1.2
2 s; 235 °C: Solder bath method; SnPb40
for 2 s at 235 °C; solder bath (SnPb40)
3 s; 245 °C: Solder bath method;
3 x 360° in opposite directions
Thermal shock: 10 s; 260 °C;
for 3 s at 245 °C; solder bath
30 min at + 155 °C; 5 cycles
Ø 0.7 mm; load 5 N; 4 x 90°
Ø 0.7 mm; load 10 N; 10 s
8 h steam or 16 h 155 °C;
[e-mail]
leads immersed 6 mm;
(SnAg3Cu0.5) method
30 min at - 55 °C and
In the Test Procedures and Requirements table the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods. A
short description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
3 mm from body
PROCEDURE
SnAg3Cu0.5
∆ T
(K)
50
40
30
20
10
0
point) as a function of dissipated power at various
Temperature rise (ΔT) at the lead end (soldering
0
lead lengths after mounting
0.4
Vishay BCcomponents
Good tinning (≥ 95 % covered); no
Good tinning (≥ 95 % covered); no
ΔR max.: ± (0.5 % R + 0.05 Ω)
ΔR max.: ± (0.5 % R + 0.05 Ω)
ΔR max.: ± (0.5 % R + 0.05 Ω)
Number of failures < 10 x 10
Number of failures < 10 x 10
5 mm
10 mm
15 mm
REQUIREMENTS
No damage
0.8
damage
damage
P (W)
www.vishay.com
VR37
1.2
-6
-6
205