03028-BX102BKZ AVX Corporation, 03028-BX102BKZ Datasheet - Page 125
![Mil Prf 55681 MLCChips](/photos/26/56/265600/4419919_sml.jpg)
03028-BX102BKZ
Manufacturer Part Number
03028-BX102BKZ
Description
Mil Prf 55681 MLCChips
Manufacturer
AVX Corporation
Series
DSCC 03028r
Datasheet
1.03028-BX102BKZ.pdf
(202 pages)
Specifications of 03028-BX102BKZ
Capacitance
1000pF
Capacitance Tolerance
± 10%
Voltage Rating
100V
Capacitor Case Style
0603
Capacitor Mounting
SMD
Temperature Coefficient
+15%, -25%
No. Of Pins
2
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HOW TO ORDER
TCP Series
Low ESR Tantalum Modules
124 | www.avx.com
Type
TC
1,320
1,980
132
188
198
200
282
400
440
600
660
880
18.8
20
28.2
40
60
66
94
μF
9.4
Capacitance
Case
2H
Size
figures 3rd digit
zeros to follow)
Capacitance
1st two digits
represents
(number of
significant
represent
pF code:
multiplier
945
Code
Code
945
196
206
286
406
606
666
946
137
197
207
207
287
407
447
607
667
887
138
208
Capacitance
Tolerance
M = ±20%
K = ±10%
J = ±5%
K
2H (50)
4H (25)
6H (17)
6V
006 = 6Vdc
010 = 10Vdc
015 = 15Vdc
020 = 20Vdc
025 = 25Vdc
035 = 35Vdc
050 = 50Vdc
Voltage
050
Code
TCP Series tantalum modules represents the
highest packing density for high capacitance /
voltage available in surface mount tantalum.
These modules feature stacked assemblies of
CWR29 capacitors which provide ultra low ESR
and utilize established reliability capacitors
(Weibull Grade voltage conditioning) in accor-
dance with MIL-PRF-55365. They can also be
supplied with SRC9000 Space Level compo-
nents.
2H (50)
4H (25)
6H (17)
10V
Standard or
L = Low ESR
Low ESR
Range
L
2H (63)
4H (31)
6H (21)
B = Bulk
R = 7" T&R
Packaging
15V
R
Rated voltage DC (V
Inspection Level
D = DSCC DWG
http://www.avx.com/docs/catalogs/tcp.pdf
S = Std.
L = Group A
2H (75)
4H (38)
6H (25)
Conformance
20V
#
Check for up-to-date CV Tables at
Weibull:
B = 0.1%/1000 hrs.
C = 0.01%/1000 hrs.
D = 0.001%/1000 hrs.
Z = Non-ER
Reliability Grade
2H (85)
4H (43)
6H (28)
90% conf.
90% conf.
90% conf.
25V
R
) to 85ºC
@
The stacked construction of fully molded capaci-
tors is compatible with a wide range of SMT board
assembly processes including wave or reflow sol-
der or conductive epoxy.
There are two termination finishes available: hot
solder dipped (“C”) and gold plated (“B”).
The molding compound has been selected to
meet the requirements of UL94V-0 and outgassing
requirements of NASA SP-R-0022A.
2H (200)
4H (100)
6H (67)
Qualification
0 = N/A
9 = SRC9000
35V
Level
0
Termination Finish
2H (200)
4H (100)
6H (67)
8 = Hot Solder
9 = Gold Plated
50V
Dipped
^
00 = None
23 = 10 Cycles, +25ºC
24 = 10 Cycles,
45 = 10 cycles,
-55ºC & +85ºC
-55ºC & +85ºC
before Weibull
Surge Test
Option
++
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