B32656S8225K561 EPCOS Inc, B32656S8225K561 Datasheet - Page 23
![Film Cap 2.2000uF 10% 850V MKP BOX](/photos/0/98/9891/b32656s8225k561_sml.jpg)
B32656S8225K561
Manufacturer Part Number
B32656S8225K561
Description
Film Cap 2.2000uF 10% 850V MKP BOX
Manufacturer
EPCOS Inc
Series
MKP B32656Sr
Datasheet
1.B32656S8225K561.pdf
(31 pages)
Specifications of B32656S8225K561
Capacitance
2.2µF
Voltage - Ac
450V
Voltage - Dc
850V
Dielectric Material
Polypropylene, Metallized
Tolerance
±10%
Operating Temperature
-55°C ~ 110°C
Mounting Type
Chassis Mount
Package / Case
Rectangular Box
Size / Dimension
1.654" L x 1.181" W (42.00mm x 30.00mm)
Height
1.772" (45.00mm)
Termination
Screw Terminals
Lead Spacing
1.102" (28.00mm)
Features
AC and Pulse
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
495-3952
1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
max
. Long exposure to temperatures above this type-related temperature limit
Page 23 of 31
Snubber (wound)
B32656S