MAX1582ETC-T Maxim Integrated Products, MAX1582ETC-T Datasheet - Page 8

• Manufacturer Part Number: MAX1582ETC-T
• Description: LED Drivers High Efficiency 26V Step-Up Converter fo
• Manufacturer: Maxim Integrated Products

Specifications of MAX1582ETC-T

• Number Of Segments: 6
• Operating Supply Voltage: 2.6 V to 5.5 V
• Maximum Power Dissipation: 1349 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TQFN EP
• Minimum Operating Temperature: - 40 C

When laying out a board, minimize trace lengths
between the IC and R
the input capacitor, and the output capacitor. Keep
traces short, direct, and wide. Keep noisy traces, such
as the LX node trace, away from CS. The input bypass
capacitor (C
possible. For the thin QFN package, PGND and GND
should be connected directly to the exposed paddle
underneath the IC. The ground connections of C
C
traces from IN to the inductor and from the Schottky
diode to the LEDs can be longer.
TRANSISTOR COUNT: 2546
PROCESS: BiCMOS
High-Efficiency Step-Up Converters
for White LED Main and Subdisplay Backlighting
*EP = Exposed paddle.
+Denotes lead-free package.
UCSP is a trademark of Maxim Integrated Products, Inc.
8
M A X1 5 8 2 YE BE - T -40°C to +85°C 16 UCSP-16
M AX 1582Y E BE + T -40°C to +85°C 16 UCSP-16
MAX1582YETC
MAX1582YETC+ -40°C to +85°C 12 Thin QFN-EP*
OUT1
_______________________________________________________________________________________
PART
should be as close together as possible. The
IN
) should be placed as close to the IC as
-40°C to +85°C 12 Thin QFN-EP*
TEMP RANGE PIN-PACKAGE
Ordering Information
SENSE
Chip Information
, the inductor, the diode,
1582YEBE
1582YEBE
MARK
AAEV
AAEV
TOP
IN
and
(BALLS SOLDERED DOWN)
Pin Configurations (continued)
TOP VIEW
A
B
C
D
PGND
OUT1
V+
LX
1
OUT2
VP
2
MAX1582
UCSP
CTRL
CS
3
COMP
GND
EN1
EN2
4