MAX3736ETE Maxim Integrated Products, MAX3736ETE Datasheet - Page 2

• Manufacturer Part Number: MAX3736ETE
• Description: Laser Driver 3.2Gbps, Low-Power, Compact, SFP Laser D
• Manufacturer: Maxim Integrated Products
• Type: SFP Laser Driverr

Specifications of MAX3736ETE

• Data Rate: 3.2 Gbps
• Operating Supply Voltage: 3.3 V
• Supply Current: 22 mA
• Package / Case: TQFN-16
• Maximum Power Dissipation: 2 W
• Mounting Style: SMD/SMT

ABSOLUTE MAXIMUM RATINGS
Power-Supply Voltage V
Voltage at IN+, IN-, DIS…..…………………-0.5V to (V
Voltage at BC_MON, MODSET, BIASSET .............-0.5V to +3.0V
Voltage at OUT+, OUT-.……………………+0.5V to (V
Voltage at BIAS ............……………………+0.5V to (V
Current into BIAS, OUT+, OUT- ......................-20mA to +150mA
Current into IN+, IN-......…………………………-20mA to +20mA
Continuous Power Dissipation (T
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
ELECTRICAL CHARACTERISTICS
(V
otherwise noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Power-Supply Current
I/O SPECIFICATIONS
Differential Input Voltage
Common-Mode Input Voltage
Differential Input Resistance
DIS Input Pullup Resistance
DIS Input Current
DIS Input High Voltage
DIS Input Low Voltage
BIAS GENERATOR
Bias Current Range
Bias Off-Current
BIASSET Current Gain
BIASSET Current Gain Stability
BIASSET Current Gain Linearity
Bias Overshoot
Bias-Current Monitor Gain
Bias-Current Monitor Gain
Stability (Notes 4, 5)
CC
16-Pin Thin QFN (derate 25mW/°C above +85°C) .............2W
_______________________________________________________________________________________
= +2.97V to +3.63V, T
PARAMETER
CC
..................................-0.5V to +6.0V
A
= -40°C to +85°C. Typical values are at V
A
= +85°C)
SYMBOL
I
BIASOFF
V
R
G
I
BIAS
I
INCM
R
V
PULL
V
V
BIAS
CC
ID
IN
IH
IL
Excludes the laser bias and modulation
currents (Note 2)
V
V
V
Current into BIAS pin
Current into BIAS pin, DIS asserted high
(Note 3)
10mA
10mA
During SFP module hot plugging;
see Figure 3 (Notes 5, 6)
(Note 5)
1mA
5mA
10mA
ID
DIS
DIS
CC
CC
CC
= V
= V
= V
+ 0.5V)
+ 0.5V)
+ 1.5V)
I
I
IN+
BIAS
BIAS
I
I
I
CC
GND
BIAS
BIAS
BIAS
- V
, V
IN-
5mA
10mA
CONDITIONS
CC
100mA (Note 4)
100mA (Note 5)
100mA
, Figure 1
= 3.3V, R
Operating Junction Temperature Range ..........-55°C to +150°C
Storage Temperature Range .............................-55°C to +150°C
Die Attach Temperature ..................................................+400°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
5mA
10mA
CC
Lead(Pb)-free...............................................................+260°C
Containing lead(Pb) .....................................................+240°C
= +3.3V, I
PULL
I
BIAS
I
BIAS
= 7.4k
BIAS
10mA
100mA
= 20mA, I
MIN
-4.4
-2.3
0.2
4.7
2.0
85
70
79
-7
-5
1
MOD
= 30mA, T
0.6
TYP
-450
13.7
|
|
V
100
7.2
2.8
2.4
22
85
85
|
CC
4
|
|
|
A
MAX
+2.3
10.0
115
100
100
2.4
0.8
= +25°C, unless
+4
+7
+5
35
15
95
91
10
UNITS
mA/A
V
A/A
mA
mA
k
μA
μA
%
%
%
%
P-P
V
V
V