MAX3996CGP Maxim Integrated Products, MAX3996CGP Datasheet - Page 6

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MAX3996CGP

Manufacturer Part Number
MAX3996CGP
Description
Laser Driver +3.0V to +5.5V, 2.5G bps VCSEL and Laser
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX3996CGP

Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MAX3996CGP+T
Manufacturer:
MAXIM/美信
Quantity:
20 000
3.0V to 5.5V, 2.5Gbps VCSEL
and Laser Driver
6
6, 16, 19
PIN
3, 9
10
11
12
13
14
15
17
18
20
EP
_______________________________________________________________________________________
1
2
4
5
7
8
Exposed Pad
TX_DISABLE
SHDNDRV
MODSET
PORDLY
FAULT
NAME
MON1
MON2
COMP
OUT+
OUT-
GND
BIAS
V
IN+
MD
IN-
TC
CC
Temperature Compensation Set. The resistor at TC programs the temperature-increasing component
of the laser-modulation current.
Fault Indicator. See Table 1.
Ground
Transmit Disable. Laser output is disabled when TX_DISABLE is high or left unconnected. The laser
output is enabled when this pin is asserted low.
Power-On Reset Delay. A capacitor connected between PORDLY and GND can be used to extend the
delay for the power-on reset circuit. See the Design Procedure section.
Supply Voltage
Noninverting Data Input
Inverting Data Input
Attaches to the emitter of the bias driving transistor through a 10Ω resistor. See the Design Procedure
section.
This pin attaches to the emitter of the bias driving transistor. See the Design Procedure section.
A capacitor connected from this pin to ground sets the dominant pole of the APC loop. See the Design
Procedure section.
Monitor Diode Connection. MD is used for automatic power control.
Shutdown Driver Output. Provides a redundant laser shutdown.
Laser Bias Current Output
Positive Modulation-Current Output. Current flows from this pin when input data is high.
Negative Modulation-Current Output. Current flows to this pin when input data is high.
A resistor connected from this pin to ground sets the desired modulation current.
Ground. This must be soldered to the circuit board ground for proper thermal and electrical
performance. See the Layout Considerations section.
FUNCTION
Pin Description

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