TFDU4300-TT3 Vishay, TFDU4300-TT3 Datasheet - Page 8
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TFDU4300-TT3
Manufacturer Part Number
TFDU4300-TT3
Description
Infrared Transceivers SIR 115.2 kbits/s 2.4-5.5V Op Voltage
Manufacturer
Vishay
Type
TX/RXr
Series
-r
Datasheet
1.TFDU4300-TT3.pdf
(13 pages)
Specifications of TFDU4300-TT3
Wavelength
900 nm
Continual Data Transmission
115.2 Kbit/s
Transmission Distance
0.7 m
Radiant Intensity
65 mW/sr
Half Intensity Angle Degrees
48 deg
Pulse Width
2 us
Maximum Rise Time
100 ns
Maximum Fall Time
100 ns
Operating Voltage
2.4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 30 C
Dimensions
8.5 mm x 2.9 mm x 2.5 mm
Data Rate
115.2Kbps
Peak Wavelength
900nm
Angle Of Half Sensitivity
48°
Package Type
SMD
Fall Time
100ns
Rise Time
100ns
Operating Supply Voltage (typ)
2.5/3.3/5V
Operating Supply Voltage (min)
2.4V
Operating Supply Voltage (max)
5.5V
Mounting
Surface Mount
Pin Count
8
Operating Temp Range
-30C to 85C
Operating Temperature Classification
Commercial
Idle Current, Typ @ 25° C
75µA
Link Range, Low Power
70cm
Operating Temperature
-30°C ~ 85°C
Orientation
Top View
Shutdown
Yes
Size
8.5mm x 2.9mm x 2.5mm
Standards
IrPHY 1.0
Supply Voltage
2.4 V ~ 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU4300 is a lead (Pb)-free transceiver
and qualified for lead (Pb)-free processing. For
lead (Pb)-free solder paste like Sn
Cu, there are two standard reflow profiles: Ramp-
Soak-Spike (RSS) and Ramp-To-Spike (RTS). The
Ramp-Soak-Spike profile was developed primarily for
reflow ovens heated by infrared radiation. With wide-
spread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown
below in figure 5 and 6 are VISHAY's recommended
profiles for use with the TFDU4300 transceivers. For
more details please refer to the application note “SMD
Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not
recommended. Ramp-up rates faster than 1.3 °C/s
could damage an optical part because the thermal
conductivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned application note, describing manual
soldering and desoldering.
Document Number 82614
Rev. 1.8, 19-Feb-09
Figure 4. Recommended Solder Profile for Sn/Pb soldering
19535
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 to 4 °C/s
50
100
160 °C max.
240 °C max.
120 to180 s
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
150
Time/s
For technical questions within your region, please contact one of the following:
2 to 4 °C/s
200
90 s max.
10 s max. at 230 °C
250
(3.0-4.0)
300
Ag
(0.5-0.9)
350
Storage
The storage and drying processes for all VISHAY
transceivers
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
“Taping, Labeling, Storage and Packing”.
TFDU Fig3
19532
280
240
200
160
120
275
250
225
200
175
150
125
100
80
40
0
75
50
25
0
0
Figure 5. Solder Profile, RSS Recommendation
0
2 °C to 3 °C/s
Figure 6. RTS Recommendation
50
50
T ≥ 217 °C for 70 s max.
(TFDUxxxx
T ≥ 255 °C for 10 s....30 s
T peak = 260 °C max.
100
1.3 °C/s
100
Peak temperature T
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
90 s to 120 s
Vishay Semiconductors
150
Time/s
Time/s
150
and
200
peak
200
TFDU4300
70 s max.
30 s max.
< 4 °C/s
= 260 °C
TFBSxxx)
250
www.vishay.com
< 2 °C/s
T peak = 260 °C
250
2 °C to 4 °C/s
300
300
350
are
211