TFDU4300-TT3 Vishay, TFDU4300-TT3 Datasheet - Page 8

• Manufacturer Part Number: TFDU4300-TT3
• Description: Infrared Transceivers SIR 115.2 kbits/s 2.4-5.5V Op Voltage
• Manufacturer: Vishay
• Type: TX/RXr
• Series: -r

Specifications of TFDU4300-TT3

• Wavelength: 900 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 0.7 m
• Radiant Intensity: 65 mW/sr
• Half Intensity Angle Degrees: 48 deg
• Pulse Width: 2 us
• Maximum Rise Time: 100 ns
• Maximum Fall Time: 100 ns
• Operating Voltage: 2.4 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 30 C
• Dimensions: 8.5 mm x 2.9 mm x 2.5 mm
• Data Rate: 115.2Kbps
• Peak Wavelength: 900nm
• Angle Of Half Sensitivity: 48°
• Package Type: SMD
• Fall Time: 100ns
• Rise Time: 100ns
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -30C to 85C
• Operating Temperature Classification: Commercial
• Idle Current, Typ @ 25° C: 75µA
• Link Range, Low Power: 70cm
• Operating Temperature: -30°C ~ 85°C
• Orientation: Top View
• Shutdown: Yes
• Size: 8.5mm x 2.9mm x 2.5mm
• Standards: IrPHY 1.0
• Supply Voltage: 2.4 V ~ 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU4300 is a lead (Pb)-free transceiver
and qualified for lead (Pb)-free processing. For
lead (Pb)-free solder paste like Sn
Cu, there are two standard reflow profiles: Ramp-
Soak-Spike (RSS) and Ramp-To-Spike (RTS). The
Ramp-Soak-Spike profile was developed primarily for
reflow ovens heated by infrared radiation. With wide-
spread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown
below in figure 5 and 6 are VISHAY's recommended
profiles for use with the TFDU4300 transceivers. For
more details please refer to the application note “SMD
Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not
recommended. Ramp-up rates faster than 1.3 °C/s
could damage an optical part because the thermal
conductivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned application note, describing manual
soldering and desoldering.
Document Number 82614
Rev. 1.8, 19-Feb-09
Figure 4. Recommended Solder Profile for Sn/Pb soldering
19535
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 to 4 °C/s
50
100
160 °C max.
240 °C max.
120 to180 s
[e-mail], [e-mail], [e-mail]
150
Time/s
For technical questions within your region, please contact one of the following:
2 to 4 °C/s
200
90 s max.
10 s max. at 230 °C
250
(3.0-4.0)
300
Ag
(0.5-0.9)
350
Storage
The storage and drying processes for all VISHAY
transceivers
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
“Taping, Labeling, Storage and Packing”.
TFDU Fig3
19532
280
240
200
160
120
275
250
225
200
175
150
125
100
80
40
0
75
50
25
0
0
Figure 5. Solder Profile, RSS Recommendation
0
2 °C to 3 °C/s
Figure 6. RTS Recommendation
50
50
T ≥ 217 °C for 70 s max.
(TFDUxxxx
T ≥ 255 °C for 10 s....30 s
T peak = 260 °C max.
100
1.3 °C/s
100
Peak temperature T
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
90 s to 120 s
Vishay Semiconductors
150
Time/s
Time/s
150
and
200
peak
200
TFDU4300
70 s max.
30 s max.
< 4 °C/s
= 260 °C
TFBSxxx)
250
www.vishay.com
< 2 °C/s
T peak = 260 °C
250
2 °C to 4 °C/s
300
300
350
are
211