TFDU6102-TR3 Vishay, TFDU6102-TR3 Datasheet - Page 9

• Manufacturer Part Number: TFDU6102-TR3
• Description: Infrared Transceivers FIR 4 Mbits/s
• Manufacturer: Vishay
• Type: TX/RXr

Specifications of TFDU6102-TR3

• Wavelength: 900 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 1 m
• Radiant Intensity: 170 mW/sr
• Half Intensity Angle Degrees: 48 deg
• Pulse Width: 2.1 us
• Maximum Rise Time: 40 ns
• Maximum Fall Time: 40 ns
• Led Supply Voltage: - 0.5 V to 6.5 V
• Operating Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 9.7 mm x 4.7 mm x 4 mm
• Data Rate: 4Mbps
• Peak Wavelength: 900nm
• Angle Of Half Sensitivity: 48°
• Communication Distance: 100
• Package Type: Ultra Small Profile
• Fall Time: 40ns
• Rise Time: 40ns
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TFDU6102
Vishay Semiconductors
Recommended Solder Profiles for TFDU6102
Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFDU6102 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)-
free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 4 and 5 are VISHAY's recommended profiles for
use with the TFDU6102 transceivers. For more
details please refer to the application note
“SMD Assembly Instructions”
(http://www.vishay.com/docs/82602/82602.pdf).
A ramp-up rate less than 0.9 °C/s is not recom-
mended. Ramp-up rates faster than 1.3 °C/s could
damage an optical part because the thermal conduc-
tivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
www.vishay.com
290
19535
Figure 3. Recommended Solder Profile for Sn/Pb soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
90 s max.
250
300
350
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19532
280
260
240
220
200
180
160
140
120
100
275
250
225
200
175
150
125
100
80
60
40
20
75
50
25
0
0
0
0
Figure 4. Solder Profile, RSS Recommendation
2 °C...3 °C/s
50
50
T ≥ 217 °C for 70 s max
T ≥ 255 °C for 10 s....30 s
Figure 5. RTS Recommendation
100
1.3 °C/s
100
90 s...120 s
T
peak
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
Peak temperature T
= 260 °C max
150
Time/s
Time/s
150
peak
200
= 260 °C
Document Number 82550
70 s max.
30 s max.
200
< 4 °C/s
250
Rev. 1.7, 21-Aug-06
T peak = 260 °C
< 2 °C/s
2 °C...4 °C/s
250
300
350
300