ABLS-24.000MHZ-D-R60-1-W-T Abracon Corporation, ABLS-24.000MHZ-D-R60-1-W-T Datasheet - Page 5

CRYSTAL 24.000MHZ SMD

ABLS-24.000MHZ-D-R60-1-W-T

Manufacturer Part Number
ABLS-24.000MHZ-D-R60-1-W-T
Description
CRYSTAL 24.000MHZ SMD
Manufacturer
Abracon Corporation
Series
ABLSr
Type
MHz Crystalr

Specifications of ABLS-24.000MHZ-D-R60-1-W-T

Frequency
24MHz
Frequency Stability
±25ppm
Frequency Tolerance
±10ppm
Load Capacitance
18pF
Operating Mode
Fundamental
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
HC49/US
Size / Dimension
0.450" L x 0.190" W (11.40mm x 4.70mm)
Height
0.165" (4.20mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
535-9701-2
6.0 Reliability Test
6.1 Reflow Profile
The Power Of Linking Together
No.
1
2
3
4
5
6
7
8
9
ABRACON
CORPORATION
Temperature Cycling:
Gross Leak Test:
Fine Leak Test:
Thermal Shock:
Solderability:
Test Items
Drop Test:
Lead Bend
Vibration:
Humidity:
Drawing No. :
The component shall remain within the electrical specification
(± 5 ppm max) after 3 cycles of high and low temperature
testing (-40°C to +85°C) for 2 hours max.
The component shall remain within the electrical specification
after exposure at extreme temperature -40°C to +85°C for 5
minutes for 3 cycles.
The component shall remain within the electrical specification after
loaded vibration at 10Hz to 55Hz, amplitude 1.5mm, within 1 minute
for 2 hours minimum on each axis (X,Y,Z).
The component shall remain within the electrical
specifications after a natural drop (3X) on a hard wooden
board at 75 cm.
The component shall remain within the electrical
specifications after being kept at a condition of ambient
temperature +85°C, 85% RH for 96 hours minimum.
Expose samples to 60PSIG Helium gas for 2 hours.
Max leak rate 2X10-8atmcc/s.
Submerge samples in 100% De-ionized water or
Perfluorocarbon at 85°C for at least 1 minute. Check for
bubbles.
Solderability of terminals shall be kept at more than 95% after
dipped in solder flux at 230°C ± 5°C for 5 seconds.
The component shall withstand maximum bend of 90°C
reference to base for 2 bends. Solder tinning must be
4 microns thick minimum.
452489
Test Conditions
Rev. -
Page 5 of 7

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