GRM21BR71H104KA01L Murata, GRM21BR71H104KA01L Datasheet - Page 182
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GRM21BR71H104KA01L
Manufacturer Part Number
GRM21BR71H104KA01L
Description
CAPACITOR, 0805 100NF 50V CAPACITOR, 0805 100NF 50V
Manufacturer
Murata
Series
GRM21r
Specifications of GRM21BR71H104KA01L
Tolerance (+ Or -)
10%
Voltage
50VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
2mm
Product Depth (mm)
1.25mm
Product Height (mm)
1.25mm
Product Diameter (mm)
Not Requiredmm
Capacitance
.1uF
Package / Case
0805
Voltage Rating, Dc
50V
Capacitor Dielectric Type
CERAMIC MULTI-LAYER
Tolerance,
10%
Tolerance, -
10%
Temp, Op. Max
125(DEGREE C)
Temp,
ROHS COMPLIANT
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GRM21BR71H104KA01L
Manufacturer:
MURATA
Quantity:
640 000
Company:
Part Number:
GRM21BR71H104KA01L
Manufacturer:
MURATA
Quantity:
400 000
Company:
Part Number:
GRM21BR71H104KA01L
Manufacturer:
MURATA
Quantity:
189 000
Part Number:
GRM21BR71H104KA01L 0805 X7R 104K 50V
Manufacturer:
MURATA/村田
Quantity:
20 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
No.
12 Deflection
13
14
15
16
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Only for Information Devices Specifications and Test Methods
Continued from the preceding page.
Solderability of
Termination
Resistance
to Soldering
Heat
Temperature
Cycle
Humidity
(Steady
State)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
No marking defects
75% of the terminations are to be soldered evenly and continuously.
No marking defects
Within T10%
0.025 max.
More than 1,000M
In accordance with item No.4
No marking defects
Within T15%
0.05 max.
More than 3,000M
In accordance with item No.4
No marking defects
Within T15%
0.05 max.
More than 1,000M
In accordance with item No.4
4.5Z2.0
4.5Z3.2
5.7Z5.0
LZW
(mm)
3.5
3.5
4.5
a
d
Specifications
100
b
c
a
Fig. 2
Dimension (mm)
7.0
7.0
8.0
b
4.5
t : 1.6
2.4
3.7
5.6
c
GR4 Series Specifications and Test Methods
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5 C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
*Preheating
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
#Pretreatment
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
#Pretreatment
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Step
Step
W24
1
2
1
2
3
4
Y 0
hrs.
Max. Operating Temp.T2
Min. Operating Temp.T3
235T5 C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (D)
R230
Capacitance meter
Temperature
Room Temp.
Room Temp.
100 to 120D
170 to 200D
45
Fig. 3
Fig. 4
Test Method
20 50
45
Continued on the following page.
Pressurize
Pressurizing
speed: 1.0mm/s
W
W
W
Y10
Y10
Y10
0
0
0
Flexure=1
D for 60T5 min. and then
D for 60T5 min. and then
D for 60T5 min. and then
Solder resist
Cu
(in mm)
Time (min.)
1 min.
1 min.
30T3
2 to 3
30T3
2 to 3
Time
181
C02E.pdf
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