GRM31MR71E224KA01L Murata, GRM31MR71E224KA01L Datasheet - Page 212
GRM31MR71E224KA01L
Manufacturer Part Number
GRM31MR71E224KA01L
Description
Manufacturer
Murata
Datasheet
1.GRM31MR71E224KA01L.pdf
(220 pages)
Specifications of GRM31MR71E224KA01L
Tolerance (+ Or -)
10%
Voltage
25VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
3.2mm
Product Depth (mm)
1.6mm
Product Height (mm)
1.15mm
Product Diameter (mm)
Not Requiredmm
Capacitance
.22uF
Package / Case
1206
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GRM31MR71E224KA01L
Manufacturer:
MURATA
Quantity:
42 000
- Current page: 212 of 220
- Download datasheet (4Mb)
18
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Vibration and Impact
3. Land Layout for Cropping PC Board
210
!Caution
[Component Direction]
Caution (Soldering and Mounting)
Do not expose a capacitor to excessive shock or vibration
during use.
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
<Example
to be avoided>
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
<Examples
of improvements>
Locate chip
horizontal to the
direction in which
stress acts.
2. Circuit Board Material
[Chip Mounting Close to Board Separation Point]
It is possible for the chip to crack by the expansion and
shrinkage of a metal board.
Please contact us if you want to use our ceramic
capacitors on a metal board such as Aluminum.
Perforation
A
Slit
B
D
C
Continued on the following page.
Chip arrangement
Worst AGCGB~D Best
C02E.pdf
09.9.18
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