82IC3150AA50J Kemet, 82IC3150AA50J Datasheet - Page 3

• Manufacturer Part Number: 82IC3150AA50J
• Manufacturer: Kemet

Specifications of 82IC3150AA50J

• Tolerance (+ Or -): 5%
• Voltage: 250VDC/160VAC
• Temp Coeff (dielectric): PLYE
• Mounting Style: Through Hole
• Construction: Radial
• Failure Rate: Not Required
• Seated Plane Height: 11mm
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 11mm
• Product Depth (mm): 6mm
• Product Length (mm): 7.2mm
• Lead Spacing (nom): 5mm
• Lead Diameter (nom): 0.5mm
• Operating Temp Range: -55C to 105C
• Capacitance: .15uF
• Package / Case: Not Required
• Lead Free Status / RoHS Status: Compliant

eleCTRICAl ChARACTeRISTICS
Rated voltage (V
Rated temperature (T
Temperature derated voltage:
for temperatures between +85°C and +105°C a decreasing
factor of 1.25% per degree °C on the rated voltage V
and a.c.) has to be applied.
Capacitance range:
Capacitance values:
Capacitance tolerances (measured at 1 khz):
±5% (J); ±10% (K); ±20% (M).
Total self-inductance (l): ≈7nH
max 1 nH per 1 mm lead and capacitor length.
Dissipation factor (DF):
tgδ 10
Insulation resistance:
Test voltage between terminations:
1.4xV
09/2008
100
kHz
10
Test conditions
Temperature:
Voltage charge time:
Voltage charge:
Performance
For V
≥ 15000 MΩ for C ≤ 0.33µF
≥ 5000 s
≥ 1000 s
For V
≥ 30000 MΩ
*Typical value
1
R
-4
applied for 2 s at +25°C±5°C.
at +25°C ±5°C
C
R
R
≤
≤
≤
≤100 Vdc
>100 Vdc
≤
120
250
0.1µF
80
for C > 0.33µF and ≤1µF
for C > 1µF
R
):
C > 0.1µF
≤
≤
R
120
):
80
100 Vdc for V
50 Vdc for V
250 Vdc
+85 °C
1000pF to 4.7µF
e6 series (IeC 60063 Norm).
+25°C±5°C
1 min
50 Vdc
400 Vdc
63 Vdc
R
R
<100 Vdc
≥100 Vdc
100 Vdc
R
(d.c.
28
MeTAllIZeD POlyeSTeR FIlM CAPACITOR
D.C. MulTIPuRPOSe APPlICATIONS
p = 5 mm
PRoDUCT CoDe: R82
TeST MeThOD AND PeRFORMANCe
Damp heat, steady state:
endurance:
Resistance to soldering heat:
long term stability (after two years):
RelIABIlITy:
Reference MIL HDB 217
Test conditions
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|: ≤ 5%
DF change (∆tgδ):
Insulation resistance:
Test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|: ≤ 5%
DF change (∆tgδ): ≤ 30x10
Insulation resistance:
Test conditions
Solder bath temperature:
Dipping time (with heat screen):10 s ±1 s
Performance
Capacitance change |∆C/C|: ≤2%
DF change (∆tgδ):
Insulation resistance:
Storage: standard environmental conditions (see page 12).
Performance
Capacitance change |∆C/C|: ≤ 3% for C≤ 0.1µF
Application conditions:
Temperature:
Voltage:
Failure rate:
(1 FIT = 1x10
Failure criteria:
(according to DIN 44122)
Short or open circuit
Capacitance change |∆C/C|: > 10%
DF change (∆tgδ):
Insulation resistance:
-9
failures/components x h)
≤ 20x10
≤ 30x10
≤ 20x10
-4
-4
≤ 2% for C> 0.1µF
+40°C±2°C
93% ±2%
56 days
≤ 50x10
≥ 50% of initial limit.
+105°C ±2°C
2000 h
1.25xV
≥50% of initial limit.
+260°C±5°C
≥ initial limit.
+40°C±2°C
0.5xV
≤ 1 FIT
> 2 x initial limit.
< 0.005 x initial limit.
-4
-4
at 10kHz for C≤1µF
at 1kHz
at 10kHz for C≤ 1µF
at 1kHz for C> 1µF
R
C
-4
at 1kHz
for C>1µF
MKT Series
R82