R60IF3150GY3-K Kemet, R60IF3150GY3-K Datasheet - Page 5

• Manufacturer Part Number: R60IF3150GY3-K
• Manufacturer: Kemet

Specifications of R60IF3150GY3-K

• Tolerance (+ Or -): 10%
• Voltage: 250VDC/160VAC
• Mounting Style: Through Hole
• Construction: Radial
• Failure Rate: Not Required
• Seated Plane Height: 9mm
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 9mm
• Product Depth (mm): 4mm
• Product Length (mm): 13mm
• Lead Spacing (nom): 10mm
• Lead Diameter (nom): 0.6mm
• Operating Temp Range: -55C to 105C
• Capacitance: .15uF
• Package / Case: Not Required
• Lead Free Status / RoHS Status: Supplier Unconfirmed

ELECTRICAL CHARACTERISTICS
Rated voltage (V
Rated temperature (T
Temperature derated voltage:
for temperatures between +85_C and the upper operating tem-
perature ( +105_C for wound technology and +125°C for
stacked technology) a decreasing factor of 1.25% per degree
_C on the rated voltage V
Capacitance range:
Capacitance values:
E6 series (IEC 60063 Norm).
Capacitance tolerances (measured at 1 kHz):
5% (J); 10% (K); 20% (M).
Total self-inductance (L): (lead length ~2mm)
Dissipation factor (DF):
tgδ×10
Insulation resistance:
Test voltage between terminations:
1.6×V
kHz
10
Pitch (mm)
L(nH) ≈
1
Test conditions
Temperature:
Voltage charge time:
Voltage charge:
Performance
For V
≥ 3750 MΩ for C ≤0.33mF (50000 MΩ)*
≥ 1250 s
F
≥30000 MΩ for C ≤0.33mF (50000 MΩ)*
≥10000 s for
*Typical value
or V
R
-4
R
R
applied for 2 s at +25_C5_C
at +25_C 5_C
≤100 Vdc
>100 Vdc
C1mF
≤100
≤150
10
for C >0.33mF ( 5000 s)*
9
R
): 063 Vdc-100 Vdc-0160 Vdc-250 Vdc
400 Vdc-630 Vdc-1000 Vdc.
C >0.33mF (17000 s)*
R
15
10
):
R
C
≤100
>
has to be applied.
100 Vdc
+85_C
1000pF to 100mF
1mF
50 Vdc
22.5
18
+25_C5_C
1 min
27.5
18
for V
for V
R
R
37.5
22
<100 Vdc
≥100 Vdc
42
TEST METHOD AND PERFORMANCE
Damp heat, steady state:
Endurance:
Resistance to soldering heat:
Long term stability (after two years):
RELIABILITY:
Reference MIL HDB 217
Test conditions
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|: ≤5%
DF change (∆tgδ):
Insulation resistance:
Test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|: ≤5%
DF change (∆tgδ):
Insulation resistance:
Test conditions
Solder bath temperature:
Dipping time (with heat screen):10 s 1 s
Performance
Capacitance change |∆C/C|: ≤2%
DF change (∆tgδ):
Insulation resistance:
Storage
Performance
Capacitance change |∆C/C|: ≤3% for C ≤0.1mF
Application conditions:
Temperature:
Voltage:
Failure rate:
(1 FIT = 1×10
Failure criteria:
Short or open circuit
Capacitance change |∆C/C|: >10%
DF change (∆tgδ):
Insulation resistance:
METALLIZED POLYESTER FILM CAPACITOR
MULTIPURPOSE APPLICATIONS
PRODUCT CODE: R60
: standard environmental conditions (see page 11).
-9
failures/components×h)
≤50×10
≤30×10
≤50×10
≤30×10
+40_C2_C
93% 2%
56 days
≤50×10
≥50% of initial limit.
+100_C2_C
2000 h
1.25×V
≥50% of initial limit.
+260_C5_C
≥ initial limit.
≤2% for C >0.1mF
+40_C2_C
0.5×V
≤5 FIT
>2×initial limit.
<0.005×initial limit.
-4
-4
-4
-4
at 10kHz for C≤1mF
at 10kHz for C≤1mF
at 01kHz for C>1mF
at 01kHz for C>1mF
R
C
MKT Series
-4
R60
at 1kHz
02/2003