B72660M251K72 EPCOS Inc, B72660M251K72 Datasheet - Page 27

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B72660M251K72

Manufacturer Part Number
B72660M251K72
Description
Manufacturer
EPCOS Inc
Datasheet

Specifications of B72660M251K72

Technology
Metal Oxide
Capacitance Value
105pF
Clamping Current
10A
Clamping Voltage
650V
Ac Voltage Rating (max)
250VAC
Dc Voltage Rating (max)
320VDC
Operating Temp Range
-40C to 85C
Mounting
Surface Mount
Surge Current (max)
1200A
Size Code
4032
Product Length (mm)
10.2mm
Product Depth (mm)
8mm
Product Height (mm)
4.5mm
Energy
19Joule
Varistor Voltage
390V
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B72660M251K72
Manufacturer:
TDK-LAMBDA
Quantity:
12
Company:
Part Number:
B72660M251K72
Quantity:
1 000
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
SMD disk varistors (CU varistors)
Standard series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 27 of 35
As mounted on substrate

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