MEC8-150-01-L-D-RA1 Samtec Inc, MEC8-150-01-L-D-RA1 Datasheet
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MEC8-150-01-L-D-RA1
Manufacturer Part Number
MEC8-150-01-L-D-RA1
Description
Manufacturer
Samtec Inc
Type
Card Edger
Datasheet
1.MEC8-150-01-L-D-RA1.pdf
(1 pages)
Specifications of MEC8-150-01-L-D-RA1
Number Of Contacts
100POS
Number Of Contact Rows
2
Body Orientation
Right Angle
Card Thickness (mm)
1mm
Contact Plating
Gold Over Nickel
Contact Material
Phosphor Bronze
Termination Method
Solder
Mounting Style
Surface Mount
Product Height (mm)
5.77mm
Operating Temp Range
-55C to 125C
Pitch (mm)
0.8mm
Housing Material
Liquid Cryst Polymer
Housing Color
Black
Current Rating (max)
1.8A
Voltage Rating Max
265VAC
Lead Free Status / RoHS Status
Compliant
F-210-1 SUPPLEMENT
Mates with:
(1,60mm) .062" thick cards,
EEDP
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Mates with:
(1,60mm) .062" thick cards
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC8-EM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ"
(1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(4,32mm) .170" to
(5,66mm) .223"
Current Rating:
1.8A @ 30°C Temperature Rise
Voltage Rating:
265 VAC
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
RIGHT ANGLE/EDGE MOUNT SOCKETS
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC8-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over 50µ"
(1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(3,94mm) .155" to
(6,25mm) .246"
Current Rating:
1.8A @ 30°C Temperature Rise
Voltage Rating: 265 VAC
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
Note: Some sizes, styles and
options are non-standard,
non-returnable.
SPECIFICATIONS
SPECIFICATIONS
(0,80mm) .0315"
MEC8-RA, MEC8-EM SERIES
(1,80)
(5,00)
.071
MEC8
.197
MEC8
02
01
10, 13, 20, 25, 30, 37, 40, 49, 50
(0,90) .035 x
(1,40) .055 DIA
10, 20, 30, 40, 50, 60, 70
No. of Positions x (0,80) .0315 + (6,20) .244
No. of Positions x (0,80) .0315 + (3,00) .118
A
02
01
No. of Positions x (0,80) .0315 + (4,60) .181
No. of Positions x (0,80) .0315 + (7,80) .307
1
(0,80) .0315
(2,00) .0787
1
(0,80)
.0315
POSITIONS
A
PER ROW
(2,00) .0787
MEC8–110–02–L–D–RA1
POSITIONS
WWW.SAMTEC.COM
PER ROW
B
B
(4,00)
.157
MEC8–140–02–L–D–EM2
(7,40)
(4,00) .157
(1,80)
.291
.071
(1,40)
02
.055
DIA
02
POSITIONS
PER ROW
(5,77)
.227
= 10µ" (0,25µm) Gold on contact,
40
50
(8,50)
MEC8–140–02–L–D–RA1
.335
(7,00)
.276
PLATING
(2,65)
OPTION
.104
= 10µ" (0,25µm) Gold on contact,
(1,48)
.058
Matte Tin on tail
(18,90)
(22,90)
.744
.902
PLATING
OPTION
A
(9,10)
.358
(0,95)
–L
.037
Matte Tin on tail
(36,60)
(44,60)
1.441
1.756
B
–L
(3,53)
.139
1mm mating card thickness option.
D
0,80mm MEC8-RA
5,78mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
For complete test data go to
www.samtec.com?MEC8-RA or contact
sig@samtec.com
(1,05)
.041
SPECIFIC OPTION
POSITIONS
PER ROW
APPLICATION
• 1mm mating card
• Latching option (mates
Call Samtec.
40
50
60
70
RA1
SPECIFIC OPTION
MEC8–160–02–L–D–EM2
D
Call Samtec.
thickness option
with EEDP series)
APPLICATION
(18,90)
(22,90)
(26,90)
(30,90)
1.059
1.217
.744
.902
A
= (1,60mm) .062"
6.5 GHz / 13 Gbps
8.0 GHz / 16 Gbps
–EM2
(36,60)
(44,60)
(52,60)
(60,60)
thick PCB
1.441
1.756
2.071
2.386
–EM2
= Tape & Reel
Insertion Loss
Rated @ 3dB
B
OPTION
OTHER
Packaging
–TR