HSEC8-113-01-S-D-EM2L Samtec Inc, HSEC8-113-01-S-D-EM2L Datasheet
HSEC8-113-01-S-D-EM2L
Manufacturer Part Number
HSEC8-113-01-S-D-EM2L
Description
Manufacturer
Samtec Inc
Type
Card Edger
Datasheet
1.HSEC8-113-01-S-D-EM2L.pdf
(1 pages)
Specifications of HSEC8-113-01-S-D-EM2L
Number Of Contacts
26POS
Number Of Contact Rows
2
Body Orientation
Straight
Card Thickness (mm)
1.75mm
Contact Plating
Gold Over Nickel
Contact Material
Beryllium Copper
Termination Method
Solder
Mounting Style
Edge
Product Height (mm)
7mm
Operating Temp Range
-55C to 125C
Pitch (mm)
0.8mm
Housing Material
Liquid Cryst Polymer
Current Rating (max)
3.1A
Lead Free Status / RoHS Status
Compliant
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?HSEC8-EM
Insulator Material:
Liquid Crystal Polymer
Contact: BeCu
Plating: Au or Sn over
50µ" (1,27µm) Ni
Current Rating:
3.1A @ 30°C Temperature Rise
(See website for details)
Operating Temp:
-55°C to +125°C
Card Insertion Depth:
(3,15mm) .125" nominal
Lead–Free Solderable:
Yes
RoHS Compliant:
Yes
Note: Some lengths, styles
and options are non-standard,
non-returnable.
EDGE MOUNT EDGE RATE
Note: Requires PCB
thickness of (1,60mm)
.062" ±(0,08mm) .003"
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?DEC8
Insulator Material:
Black ABS
Contact: BeCu
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
3.1A @ 95°C relative to 125°C
(See website for details)
Operating Temp:
-55°C to +125°C
RoHS Compliant: Yes
F-210-1
–EM to –DV
SPECIFICATIONS
SPECIFICATIONS
HSEC8-EM, DEC8 SERIES
(0,80mm) .0315"
APPLICATIONS
APPLICATIONS
–EM to EEDP–DV
EEDP
Series
Mates with:
(1,60mm) 0.62" thick cards,
EEDP, HSC8, HSF8
Mates with:
(1,60mm) .062"
thick cards, HSC8
(17,58)
HSEC8
.692
(9,83)
.387
DEC8
(1,75)
.069
02
01
No. of Positions x (0,80) .0315 + (18,40) .724
No. of Positions x (0,80) .0315 + (7,80) .307
No. of Positions x (0,80) .0315 + (15,20) .598
No. of Positions x (0,80) .0315 + (4,60) .181
02
01
A
1
1
C
WWW.SAMTEC.COM
HSEC8–130–01–S–D–EM2
10, 20, 30, 40, 50, 60
POSITIONS
40, 50, 60
PER ROW
A
POSITIONS
(0,80) .0315
PER ROW
B
B
(4,00) .157
™
01
CARD SOCKET
(5,00)
(5,60)
.197
.220
(7,80)
.307
Card Thickness
(7,00)
.276
= (1,60) .062"
STYLE
(4,99)
LEAD
.197
–01
Moulding removed
PLATING
OPTION
POSITIONS
PER ROW
for clarity
Gold on contact,
Matte Tin on tail
= 30µ" (0,76µm)
40
50
60
–S
(18,90)
(22,90)
(26,90)
1.059
.744
.902
POSITIONS
PER ROW
A
Note: Other Gold plating
options available.
Contact Samtec.
ALSO AVAILABLE
Polarized mates for EEDP
60
40
50
CONNECTOR
(36,60)
(44,60)
(52,60)
Series twinax cables
1.441
1.756
2.071
HSEC8–113
HSEC8–125
HSEC8–137
HSEC8–149
DEC8–140–01–S
D
B
Gold on contact
= 30µ" (0,76µm)
(47,75)
(55,75)
(63,75)
1.880
2.195
2.510
PLATING
A
–S
(36,60)
(44,60)
(52,60)
1.441
1.756
2.071
B
= (1,60mm)
.062" thick
EEDP–08
EEDP–16
EEDP–24
EEDP–32
–EM2
CABLE
EM2
PCB
(18,90)
(22,91)
(26,90)
1.059
.744
.902
C
™
™
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