583616-5 TE Connectivity, 583616-5 Datasheet - Page 94
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583616-5
Manufacturer Part Number
583616-5
Description
Manufacturer
TE Connectivity
Type
Bifurcated Contactr
Datasheet
1.583616-5.pdf
(96 pages)
Specifications of 583616-5
Number Of Contacts
1POS
Number Of Contact Rows
Not Required
Body Orientation
Straight
Contact Plating
Gold Over Nickel
Contact Material
Phosphor Bronze
Termination Method
Crimp
Mounting Style
Cable
Operating Temp Range
-55C to 105C
Pitch (mm)
Not Requiredmm
Housing Material
Not Required
Housing Color
Not Required
Current Rating (max)
5A
Contact Resistance Max
10
Product Type
Contact
Termination Method To Wire/cable
Crimp
Wire Insulation Diameter (mm [in])
0.89 – 1.40 [0.035 – 0.055]
Color Code
Orange
Contact Retention In Housing
Crimp Snap-In
Solder Tail Contact Plating
Nickel (30)
Centerline (mm [in])
2.54 [0.100], 3.18 [0.125], 3.96 [0.156]
Wire Range (mm [awg])
0.08-0.24² [28-24]
Contact Configuration
Bifurcated
Contact Plating, Mating Area, Material
Gold (15)
Contact Base Material
Phosphor Bronze
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Not relevant for lead free process
Contact Packaging Method
Loose Piece
Lead Free Status / RoHS Status
Not Compliant
94
AMP ACTION PIN
Press-Fit Contacts
PC Board Thickness
ACTION PIN contacts are
designed for use in a variety of
PC board thicknesses. However,
certain ACTION PIN contacts
are to be used in specific ranges
of board thicknesses. To
promote optimum performance,
the recommended board thick-
nesses provided with the con-
nector being used must be
followed.
ACTION PIN Contact/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Connector
Linear ZIF
Type
Material Thickness
ACTION PIN
Contact
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
.025
0.64
Card Edge Connectors
(Solder Type, Board-to-Board)
Linear ZIF Connectors
Drilled Hole
Diameter
.0453
1.151
±.001
±0.03
ACTION PIN contacts provide a reliable press-fit connection.
Localized pressure in the interface area entails oxide
break-through and helps prevent corrosion in the harshest
environments to provide a reliable connection virtually every
time. Also, radial and axial distortion are controlled to meet
today’s standards for multilayer board applications.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Copper *
.001-.003
0.03-0.08
Plating Thicknesses
(Continued)
Tin-Lead
.0003
0.008
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Min.
Through-Hole
Diameter
.037-.043
0.94-1.09
Plated
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Specified
Average
Radial Hole Distortion
Not
Annular Ring (See Note)
Drilled Hole
Copper Thickness
Tin-Lead Thickness
Plated Through-Hole
Maximum
Specified
Not