DS32KHZSN# Maxim Integrated Products, DS32KHZSN# Datasheet - Page 8

• Manufacturer Part Number: DS32KHZSN#
• Description: IC OSC 32.768KHZ TEMPCOMP 16SOIC
• Manufacturer: Maxim Integrated Products
• Series: DSr
• Type: TCXOr

Specifications of DS32KHZSN#

• Supply Voltage: 5V
• Frequency: 32.768kHz
• Frequency Stability: ±7.5ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (max): 220µA
• Mounting Type: Surface Mount
• Size / Dimension: 0.412" L x 0.300" W (10.46mm x 7.62mm)
• Height: 0.105" (2.67mm)
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Supply Current: 150µA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

RELATED APPLICATION NOTES
(Go to
Application Note 58: Crystal Considerations with Dallas Real-Time Clocks
Application Note 701: Using the DS32kHz with Dallas RTCs
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
These packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions
should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent
damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The BGA package may be reflowed as long as the peak temperature does not exceed +225°C. Peak reflow
temperature (≥ 220°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed
40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow
profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that
the internal crystal is not exposed to temperatures above +150°C.
Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-
sensitive device (MSD) classifications.
THERMAL INFORMATION
PACKAGE INFORMATION
(For the latest package information, go to www.maxim-ic.com/DallasPackInfo.)
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
M a x i m I n t e g r a t e d P r o d u c t s , 1 2 0 S a n G a b r i e l D r i v e , S u n n y v a l e , C A 9 4 0 8 6 4 0 8 - 7 3 7 - 7 6 0 0
16-pin SO (300 mils)
PACKAGE TYPE
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.
14-pin Encapsulated DIP
36-pin BGA
www.maxim-ic.com/RTCapps
16-pin SO (300 mils)
PACKAGE TYPE
36-pin BGA
THETA-J
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to find these application notes and more.)
© 2007 Maxim Integrated Products
DOCUMENT NO.
56-G0001-002
56-G4009-001
56-G6023-001
THETA-J
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