1-487547-1 TE Connectivity, 1-487547-1 Datasheet - Page 19

CONTACT, SOCKET, IDC / IDT

1-487547-1

Manufacturer Part Number
1-487547-1
Description
CONTACT, SOCKET, IDC / IDT
Manufacturer
TE Connectivity
Type
Contactr
Series
-r
Datasheet

Specifications of 1-487547-1

Contact Gender
RCP
Mounting Style
Cable
Number Of Contact Rows
Not Required
Number Of Contacts
1POS
Pitch (mm)
Not Requiredmm
Body Orientation
Straight
Voltage Rating Max
100VAC
Operating Temp Range
-55C to 105C
Housing Material
Not Required
Housing Color
Not Required
Contact Material
Phosphor Bronze
Contact Plating
Gold Over Nickel
Termination Method
Crimp
Connector Type
FFC / FPC Contact
Contact Termination
Crimp
Peak Reflow Compatible (260 C)
Yes
Outer Diameter
1.27mm
Rohs Compliant
Yes
Pin Or Socket
Socket
Wire Gauge
-
Contact Finish
Gold
Contact Finish Thickness
Flash
Product Type
Contact
Termination Method To Wire/cable
IDC
Wire/cable Type
FFC
Solder Tail Contact Plating
Gold Flash
Centerline (mm [in])
1.27 [0.050]
Contact Type
Socket
Contact Plating, Mating Area, Material
Gold Flash over Palladium Nickel or Gold (30) over Nickel
Underplate Material
Nickel
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Packaging Method
Strip
Lead Free Status / RoHS Status
Compliant
For Use With
AMPMODU MTE Connectors
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
1-487547-1
Manufacturer:
TE
Quantity:
120 000
Part Number:
1-487547-1
Manufacturer:
DEL
Quantity:
35 000
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
Double row, vertical,
shrouded header and
receptacle assemblies
Available in select sizes
from 10 through 100
positions
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
Compatible with standard
surface-mount processes
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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