9-103765-0 TE Connectivity, 9-103765-0 Datasheet - Page 38

• Manufacturer Part Number: 9-103765-0
• Description: BOARD-BOARD CONN, HEADER, 40WAY, 1ROW
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU Mod IIr

Specifications of 9-103765-0

• Pitch (mm): 2.54mm
• Gender: HDR
• Number Of Contacts: 40POS
• Number Of Contact Rows: 1
• Mounting Style: Through Hole
• Body Orientation: Right Angle
• Contact Plating: Gold Over Nickel
• Operating Temp Range: -65C to 105C
• Termination Method: Solder
• Current Rating (max): 3/ContactA
• Contact Material: Phosphor Bronze
• Housing Material: Thermoplastic
• Housing Color: Black
• Product Height (mm): 3.51mm
• Product Length (mm): 101.19mm
• Product Depth (mm): 9.4mm
• Pitch Spacing: 2.54mm
• No. Of Rows: 1
• No. Of Contacts: 40
• Contact Termination: Right Angle Through Hole
• Rohs Compliant: Yes
• Product Type: Connector
• Mount Angle: Right Angle
• Pcb Mount Retention: Without
• Surface Mount Compatible: No
• Board Standoff: Without
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 5.84 [0.230]
• Panel Mount Retention: Without
• Termination Post Length (mm [in]): 2.29 [0.090]
• Solder Tail Contact Plating: Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 40
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Number Of Rows: 1
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• High Temperature Housing: No
• High Speed Serial Data Connector: No
• Lead Free Status / RoHS Status: Compliant

.025 [0.64] Square
Right-Angle Posts
Material and Finish:
Housing—Black thermoplastic, 94V-0
rated, high temperature compatible
P o s t s—Phosphor bronze, duplex plated
.000030 [0.00076] gold on contact area,
. 0 0 0 1 0 0 -.000200 [0.00254-0.00508]
matte tin-lead on solder tail, with entire
post underplated .000050 [0.00127]
nickel
Performance Characteristics
(Board Retention Tails):
Insertion Force—12 lb [53.4N] Max.
Retention Force—.25 lb [1.11N] Min.
Related Product Data:
Mateable Connectors—Refer
to the Mating Post Selection Guide
(page 89)
Technical Documents
See mating connector for applicable
product and application specifications.
Notes: 1. Headers without retention tails may be broken to the desired number of positions using Tool Kit No. 314818-1 (not shown).
Notes:
Notes: 2.
Notes: 2.
Notes: 2.
Catalog 1307819
Revised 6-04
www.tycoelectronics.com
Retention Tails
(See Note 2.)
Solder Tails
(See Notes
With Board
1 and 2.)
Header
Style
With
2. Headers are also available in sizes 4 thru 78 positions. When ordering, add the prefix and/or suffix (dash) numbers to the base
part number that corresponds with the number of positions per row. For example, the complete part number for a 16-position
header with solder tails (C dimension .120 [3.05)] would be 146308-8. The complete part number for a 40-position header with
board retention tails (C dimension .120 [3.05]) would be 2-146310-0. This part numbering system applies only to this page.
(page 294):
No. of
Pos.
80
80
2
2
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
3.984 [101.19]
3.984 [101.19]
.084 [2.13]
.084 [2.13]
*±.003 [±0.08] tolerances not to accumulate within one connector pattern.
AMPMODU Interconnection System
Headers with Board Retention Tails
Headers with Solder Tails
Breakaway Surface-Mount Compatible, High Temperature Headers—
Unshrouded, Double-Row, .100 [2.54] Centerline
A
Pattern)
(
[2.54]
Hole
.100
C L
Dimensions
(2 Plc.)
(for .062 [1.57] thick PC board; .008 [.203] thick stencil)
[1.07]
.042
(2 Plc.)
[6.05]
[1.07]
of
.042
.238
[6.05]
.238
(
*±.003 [±0.08] tolerances not to accumulate within one connector pattern.
C L
Recommended PC Board Mounting Pattern
3.900 [99.06]
3.900 [99.06]
of Hole Pattern)
[2.54]
.100
—
—
B
(for .062 [1.57] thick PC board; .008 [.203] thick stencil)
[3.81±0.05]
.150±.002
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Recommended PC Board Mounting Pattern
[2.54]
.100
[2.54]
.100*
[0.76±0.05]
.030±.002
Typ.
C = .120 [3.05]
D = .230 [5.84]
E = .185 [4.70]
[2.29±0.05] .030±.002
4-146308-0
4-146310-0
.090±.002
Part Nos.
146308-1
146310-1
.100*
[2.54]
A
B
A
B
[0.76±0.05]
[1.91]
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
.075
Typ.
(
C = .110 [2.79]
D = .318 [8.08]
E = .200 [5.08]
C L
4-146309-0
4-146311-0
Part Nos.
of Stencil Pattern)
146309-1
146311-1
[1.14]
.045
Ref.
[4.32]
.170
Recommended Hole Size
[1.02±0.08]
[1.14±0.02]
.040±.003
.045±.001
[2.54]
[2.54]
.100
.100
(
Before Plating
C L
(Contact
E Ref.
Area)
(Plated)
(Contact
of Stencil Pattern)
Recommended Hole Size
E Ref.
Area)
[0.89±0.08]
[1.14±0.02]
.035±.003
.045±.001
[2.79]
.110
Dia. Typ.
Dia. Typ.
Before Plating
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
[3.56]
.140
(Plated)
[3.56]
.140
D
D
Dia. Typ.
Dia. Typ.
using Swaged Tails
(All Header Sizes)
Board Retention
[2.54]
.100
[2.29]
.090
[2.29]
.090
[2.54]
.100
C
C
121
5