2013297-1 TE Connectivity, 2013297-1 Datasheet

2013297-1

Manufacturer Part Number

2013297-1

Description

SEMI-HARD TRAY DDR3 204P 8H STD

Manufacturer

TE Connectivity

Datasheet

1.2013297-1.pdf (1 pages)

Specifications of 2013297-1

Socket Style

SO DIMM

Dram Type

Double Data Rate (DDR) III

Pcb Mount Style

Surface Mount

Module Orientation

Right Angle

Keying

Standard

Dram Voltage

1.5 V

Socket Type

Memory Card

Number Of Positions

204

Row-to-row Spacing (mm [in])

8.20 [0.322]

Centerline (mm [in])

0.60 [0.024]

Number Of Rows

Dual

Ejector Type

Locking

Ejector Location

Both Ends

Number Of Keys

Latch Material

Stainless Steel

Latch Plating

Tin

Boss

With

Contact Plating, Mating Area, Material

Gold Flash

Contact Base Material

Copper Alloy

Housing Material

High Temperature Thermoplastic

Housing Color

Black

Stack Height (mm [in])

8.00 [0.315]

Insertion Style

Cam-In

Center Key (mm [in])

Offset Left

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Reflow solder capable to 245°C, Reflow solder capable to 260°C

Rohs/elv Compliance History

Always was RoHS compliant

Application Type

DDR 3 SO-DIMM

Packaging Method

Semi-Hard Tray Assembly

Lead Free Status / RoHS Status

Compliant

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